System and method for integrated data transfer, archiving and purging of semiconductor wafer data

ABSTRACT

A system for the integrated archiving, restoring, purging, importing and exporting of semiconductor wafer data, the system including: a data acquisition system  00  for acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools  10,  wafer inspection tools  12,  and wafer nanotopography tools  14;  a buffer system  02  for providing temporary storage for scan data transmitted over a network from the data acquisition system and for providing fault tolerance; a server system  04  for providing storage for the scan data transmitted from the buffer system  02  and converting the scan data into a format used by and stored in a database  08  management system; and an analysis system  06  client station including a display and communicating with the server system  04  over the network, the analysis system  06  and the server system  04  managing the purging, archiving, restoring, importing and exporting of scan data.

TECHNICAL FIELD

The present invention is directed to the field of materials processing,and more particularly to a system and method for integrating datatransfer, archiving and purging of semiconductor wafer data.

BACKGROUND

The manufacturing of semiconductor wafer and integrated circuits hastraditionally employed several types of systems and tools to providequality control and process monitoring.

For example, wafer geometry systems, ranging from the tabletop gauges tohigh volume multi-functional sorting systems on state of the art robotictransfer platforms, are used to obtain wafer characterization data toprovide an accurate knowledge of wafer dimensional characteristics suchas flatness, diameter, thickness, bow, warp, shape, nanotopography,resistivity, background characteristics, thermal shape change, amongothers. In addition, surface inspection systems are used to identifydefects occurring on a surface of a semiconductor wafer, such asparticles, scratches, COP's, mounds, dimples, stacking faults, haze andmore. Further, certain defect and dimensional analysis systems performthin film analysis, providing full wafer mapping of surfaces with thinepitaxial film or other dielectric films such as SiO₂, CVD, SOI, andphotoresist with transition region thickness and substrate carriers.

Software has been developed to analyze the measurement data generated bysuch systems and transform the data to produce information aboutprocess-induced defects, system degradation, and other potential problemareas. Thus, data from dimensional and inspection systems allow processengineers to maintain process control and optimal tool parameters, andprovide them with valuable insight when developing new advanced waferprocesses.

However, with the wide variety of and large amounts of data from thenumerous tools used in the manufacturing of semiconductor wafer andintegrated circuits, managing, analyzing and automating wafer data hasbecome extremely complicated. Traditionally, the data generated by thedimensional and inspection systems were treated separately, notcombined. In the past, wafer data management and analysis systems havebeen developed for dimensional systems, but they have not included datafrom surface inspection systems such as defect evaluation systems.Defect evaluation systems were developed, but they did not support wafercharacterization tools or automation features. Because the disparitiesbetween the data from the numerous systems, the ability of engineeringto use all of the data available to it to optimize manufacturingprocesses was limited.

In addition, given the large amounts of data developed by each of thenumerous tools, it has become apparent that traditional methods ofmanaging older data are inadequate. Analyzing and automating wafer datahas become extremely complicated. Further, cross-site transfer of dataand review of data from multiple fabrication processes in order tocontrol production across several manufacturing processes, whiletheoretically possible, was rendered practically difficult by the sheeramount of data and wide variation in types of data to be transferred andreviewed. It would be desirable to provide for transfer of onlyselective data to a central system to provide multi-plant productionmanagement.

Further, the amount of data produced during such production is so greatthat purging data after a selected interval is necessary in order tomake storage room available for new data to be produced. However, somedata in a data set could be useful for longer than other data.Traditionally, data purging is conducted by establishing a thresholddata and deleting data older than that date. Therefore, it has beennecessary to store un-needed data for longer than it was necessary,simply because it was in the same data set as the needed data. It wouldbe desirable to provide a purging system in which data in a data set maybe purged as it is no longer needed.

It has become desirable to provide a system for integrated wafer datamanagement and process monitoring system for data management, analysis,and automation from all systems used in the wafer and integrated circuitproduction process, including both dimensional and inspection systems,along with the software for analyzing such data.

DISCLOSURE AND SUMMARY OF INVENTION

The present invention provides an integrated semiconductor productionsystem for performing wafer data management, process monitoring, dataanalysis, and data automation, allowing for detailed offline analysis ofwafers based on data acquired from both wafer dimensional and surfaceinspection systems. The integration of wafer data management, processmonitoring, data analysis, and data automation for both defect anddimensional tools allows the identification of process-related problems,determination of the origin of those problems, and evaluation of theimpact of those problems on manufacturing yields.

The system provides integrated archiving, restoring, purging, importingand exporting of semiconductor wafer data. The system includes a dataacquisition system for acquiring scan data from differing types ofsemiconductor wafer scanning tools such as wafer dimensional tools,wafer inspection tools, and wafer nanotopography tools and also includesa buffer system for providing temporary storage for the scan datatransmitted over a network from the data acquisition system and forproviding fault tolerance, as well as a server system for providingstorage for the scan data transmitted from the buffer system and forconverting the scan data into a format used by and stored in a databasemanagement system. The system also includes an analysis system operatingin client system communicating with the server system over a network sothat the analysis system and the server system provide management forpurging, archiving, restoring, importing and exporting scan data in oneor more locations. The transfer of data can be done manually, usingmanual archive, restore or purge operations, and the system allows auser to automate archive, restore, and purge operations. The system alsoenables a user to transfer scan data to different sites for analysis andreview, enabling review of scan data from a number of production lots,processes and sites.

The integrated system allows the building of a database of wafer datausing the measurement files output by multiple wafer production systems.Querying is provided to create and save datasets using criteria based onmetrology values, identification of when the data was acquired or waferequipment, or process labels. Thumbnail images of and measurementresults for specified datasets can be viewed and sorted, the resultsexported to file, or wafers selected for use in a chart, report or wafermap. Layouts comprising saved sets of setup parameters that definedatasets, charts, reports, wafer maps and activities may be saved. Suchlayouts may be created and shared among multiple system users.

In addition, routine tasks may be automated and conditional operationsperformed based on measurement results using the Batches feature or theAutomated Activities feature. Batches link a named dataset layout with anamed report, chart or wafer map layout. The Automated Activitiesfeature comprises a visual macro system in which visual elements createdfor all of the available layouts, output to printers, statusnotification and email messages with attachments may be combined tospecify a set of actions to be executed. Decisions can be added to thevisual elements to allow varying paths of actions to be executed,depending on the outcome of a logical expression based on selected waferdata. Activities may be scheduled for execution at regular intervals orwhenever a certain trigger value or label is observed in incoming waferdata.

The integration of wafer data management, process monitoring, dataanalysis, and data automation into one system allows improved metrologyand inspection tool use, allowing for surface inspection andcharacterization of both thin film devices and bare wafers with the samesystem. With the system, engineering focus changes from data collectionto process optimization. Process excursions are identified more quickly,resulting in reduction in impact of the excursion on work in progress.Report preparation is automated, and paper based quality records areeliminated.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a block diagram of the integrated semiconductor wafer datamanagement, process monitoring, data analysis, and data automationsystem of the present invention;

FIG. 2 is a block diagram of the integrated semiconductor wafer datamanagement, process monitoring, data analysis, and data automationsystem of the present invention;

FIG. 3 is a table showing alternative configurations of the integratedsystem of the present invention;

FIG. 4 is a block diagram of the user interface screen of the presentinvention;

FIG. 5 is a block diagram of the Classic Gallery Mode screen of theWafers tab of the Utility Window shown in FIG. 4;

FIG. 6 is a block diagram of the Group Gallery Mode screen of the Waferstab of the Utility Window shown in FIG. 4;

FIG. 7 is a block diagram of the Multi Dataset Gallery Mode screen ofthe Wafers tab of the Utility Window shown in FIG. 4;

FIG. 8 is a block diagram of the Extended Data Mode screen of the Waferstab of the Utility Window shown in FIG. 4;

FIG. 9 is a block diagram of the Legends Filter tab screen of theUtility Window shown in FIG. 4;

FIG. 10 is a block diagram of examples of screens for reports, chartsand wafer map displays in the Analysis Window shown in FIG. 4;

FIG. 11 is a block diagram of a Activities editing screen for theAnalysis Window shown in FIG. 4;

FIG. 12 is a block diagram of a Properties tab for the Analysis Windowshown in FIG. 4;

FIG. 13 is a block diagram of an Attributes tab for the Analysis Windowshown in FIG. 4;

FIG. 14 is a block diagram of a Data tab for the Analysis Window shownin FIG. 4;

FIG. 15 is a block diagram of a Tasks tab for the Analysis Window shownin FIG. 4;

FIG. 16 is a block diagram of a screen for the Create Wafer Datasetdialog box for the Data Analysis System shown in FIG. 2;

FIG. 17 is a block diagram of a screen for the Layout Parameters tab ofthe Edit Layout dialog for the Data Analysis System shown in FIG. 2;

FIG. 18 is a block diagram of a screen showing the 2D Surface Contourdisplay option for specifying Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 19 is a block diagram of a screen showing the 3D Surface Contourdisplay option for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 20 is a block diagram of a screen showing the Cross Section displayoption for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 21 is a block diagram of a screen showing the Site Map displayoption for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 22 is a block diagram of a screen showing the Defect Rings displayoption for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 23 is a block diagram of a screen showing the Defect Sectorsdisplay option for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 24 is a block diagram of a screen showing the SQM Height Thresholddisplay option for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 25 is a block diagram of a screen showing the Wafers-Region displayoption for specifying the Wafer-Background Format in the LayoutParameters tab shown in FIG. 17;

FIG. 26 is a block diagram of a screen showing the Use Banded Colordisplay option for the Layout Parameters tab shown in FIG. 17;

FIG. 27 is a block diagram of a screen showing the Extension ChartLayout display option for the Layout Parameters tab shown in FIG. 17;

FIG. 28 is a block diagram of a screen showing the Contour Lines displayoption for the Layout Parameters tab shown in FIG. 17;

FIG. 29 is a block diagram of a screen showing the 3D Z-Scale option(set to 0.200) for the Layout Parameters tab shown in FIG. 17;

FIG. 30 is a block diagram of a screen showing the 3D Z-Scale option(set to 0.200) for the Layout Parameters tab shown in FIG. 17;

FIG. 31 is a block diagram of a screen showing the tree-view pane of aserver configuration for the present invention;

FIG. 32 is a block diagram of the Directory Setup screen for the serverconfiguration of the present invention;

FIG. 33 is a block diagram of the Tool Configuration screen for theConfiguration Application system of the present invention;

FIG. 34 is a block diagram of a screen for specifying thumbnail displaysfor dimensional files for the Configuration Application system of thepresent invention;

FIG. 35 is a block diagram of a screen for specifying thumbnail displaysfor defect files for the Configuration Application system of the presentinvention;

FIG. 36 is a block diagram of a screen for the Edit Keys capability forthe Configuration Application system;

FIG. 37 is a block diagram of a Dimensional Parameters screen forsetting up dimensional tools using the Configuration Application system;

FIG. 38 is a block diagram of a Nanotopography Parameters screen forsetting up nanotopography tools using the Configuration Applicationsystem;

FIG. 39 is a block diagram of a Defects Parameters screen for setting updefect inspection tools using the Configuration Application system;

FIG. 40 is a block diagram of a Defects Recipe screen for creating newdefect recipes using the Configuration Application system;

FIG. 41 is a block diagram of a Nanotopography Recipe screen forcreating new nanotopography recipes using the Configuration Applicationsystem;

FIG. 42 is a block diagram of a screen for the Dimensional Node of theServer System of the Configuration Application system;

FIG. 43 is a block diagram of a selection and specifying screen forselection and specifying dimensional recipes for creation ormodification using the Configuration Application system;

FIG. 44 is a block diagram of the main Purge Data graphics userinterface screen for the Purge capability of the present invention;

FIG. 45 is a block diagram of the Purge Mask Definition screen for thePurge Data graphics user interface of FIG. 44;

FIG. 46 is a block diagram of the Create Wafer Dataset screen for use inthe Archive/Restore capability of the present invention;

FIG. 47 is a block diagram of the screen showing the tree-view pane of aserver configuration, exploded to show the details of the definedPurge/Archive masks for an illustrative embodiment, and for managing themasks;

FIG. 48 is a block diagram of the Edit/New Archive Mask screen forediting or creating new Archive Masks;

FIG. 49 is a block diagram of a screen showing the tree-view pane of aserver configuration, exploded to show the details a tool configurationfor archive data restoration, along with a screen for a wizard for usein setting up the tool configuration for archive data restoration;

FIG. 50 is a block diagram for another screen for the wizard for use insetting up a tool configuration for archive data restoration;

FIG. 51 is a block diagram of a screen for the wizard for use in settingup a tool configuration for archive data restoration;

FIG. 52 is a block diagram of the final screen for the wizard for use insetting up a tool configuration for archive data restoration;

FIG. 53 is a block diagram of a screen for logging into the integratedsemiconductor wafer data management, process monitoring, data analysis,and data automation system of the present invention;

FIG. 54 is a block diagram of a screen for displaying a wafer mapgallery;

FIG. 55 is a block diagram of a screen for displaying data acrossfabrication sites;

FIG. 56 is a block diagram of a first screen for displaying wafers in awafer gallery;

FIG. 57 is a block diagram of another screen for displaying wafers usingthe Autonomous Updating feature, in which Autonomous Updating feature isbeing invoked;

FIG. 58 is a block diagram of a screen for selecting the AutonomousUpdating period of Autonomous Updating feature;

FIG. 59 is a block diagram of a New Wafer Map Layout screen for creatinga new wafer map layout; and

FIG. 60 is a block diagram of a Default Wafer Map Layout screen forspecifying a default wafer map layout.

DETAILED DESCRIPTION OF THE INVENTION

As seen in FIG. 1, the present invention comprises a data acquisitionsystem 00 for acquiring semiconductor wafer scan data from metrology andinspection tools such as wafer dimensional scanning tool 10, deviceinspection tool 12 and nanotopography tool 14. Each tool communicateswith data acquisition system 00 using its own communications orinterface protocol, over a communications path 18 a. Data acquisitionsystem 00, in turn, communicates over a communications path 18 withbuffer system 02. Buffer system 02 provides temporary storage 16 forscan data transmitted from the wafer scanning tools and also providesfault tolerance features. Still in FIG. 1, buffer system 02 transmitsdata to server system 04 over communications path 18. Server system 04provides storage for scan data transmitted by buffer system 02 in adatabase management system 08. Server system 04 converts the scan datainto a format used by data management system 08.

Still in FIG. 1, server system 04 transmits scan data overcommunications path 18 to one or more analysis systems 06, shown in FIG.1, as analysis systems client stations 06 a and 06 b. In the embodimentsshown, analysis systems client stations 06 a and 06 b may be in twodifferent physical locations or in different manufacturing orfabrication plants. Analysis system 06, communicating with server system04 provides wafer data management, process monitoring, wafer dataanalysis and data automation. With the system and method of the presentinvention, users are able to archive, restore, purge, import, and exportscan data to and from different locations for review, analysis, andoptimization of wafer manufacturing and device fabrication processes.The ability to combine scan data from different tools, locations andprocesses and transfer it to other locations also makes it possible forusers to search for patterns of defects or anomalies in wafers anddevices in ways that have not been possible heretofore.

With reference now to FIG. 2, the integrated semiconductor wafer datamanagement, process monitoring, data analysis, and data automationsystem of the present invention has the following components, which areconnected together using standard networking connections in theembodiments shown:

Data acquisition system 00 contains a comprehensive set of wafermetrology and inspection tools, of both defect and dimensional types.Physically, the data acquisition system 00 is resident in the clean roomin the embodiments shown.

Buffer system 02 provides normalization for networking protocols andtemporary storage for the tools data from data acquisition system 00.Preferably, the buffer system 02 is also resident in the clean room withthe data acquisition system 00. The buffer system 02 may have one BufferBox for each tool in the data acquisition system 00, or it may have oneBuffer Box for the entire tool set. Along with the data acquisitionsystem 00, buffer system 02 forms a tools network that is operable whenthe server is down. In addition, the temporary storage capability of thebuffer system 02 provides a level of fault tolerance, allowing scanningto continue, even if server system 04 is down.

The server system 04 provides storage for data from the tools of thedata acquisition system 00. Any time that a data file is input to theserver system 04 from the scan of a wafer by a tool, server system 04converts the tools' data, called in this embodiment a ProcessScan, fromthe tools' formats to the format used by the data analysis system 06.Server system 04, which may comprise one or more servers, also storesthe scan files, using relational database management for main database08to facilitate the combination of metrology and inspection tools.Server system 04 has Configuration Application software that provides aunified interface to a set of largely independent server applications.In one embodiment, the server is a computer running Microsoft SQLServer, providing and maintaining a relational database using the SQLlanguage.

Still in FIG. 2, analysis system 06, which is a client system, issoftware that conducts multi-wafer analysis on the stored scan files.The analysis system 06, in the embodiments shown, preferably comprisesmultiple desktops linked to the server.

Alternative embodiments of the integrated system of the presentinvention are shown in FIG. 3. Those skilled in the art will appreciatethat database management systems other than those provided by MicrosoftCorporation can be used without deviating from the spirit of the presentinvention. Similarly, various types of networks and computerinput/output buses can be used for the communication paths betweenelements of the present invention without deviating from the spirit ofthe invention.

Data Analysis System

Analysis system 06 has a user interface with which the system of thepresent invention can be accessed. The user interface is accessedthrough a system icon provided on the desktop screen of the computer onwhich the data analysis system 06 is located.

Note that the data analysis system 06 is a client system in theclient/server embodiment shown. While it is not necessary for dataacquisition system 00 to be operating in order to operate the analysissystem 06, server system 04 must be operating in order to use the dataanalysis system 06, when these are implemented in client/servermethodology. Those skilled in the art will appreciate that thefunctionality of analysis system 06 and server system 04 can be providedin different ways, including being implemented as one integratedapplication without deviating from the present invention. In theembodiments shown, if server system 04 is not running properly, a redicon will appear on the lower right corner of the task bar of thecomputer on which analysis system 06 is located. If a red icon appears,the user may click the icon and perform any instructions, or consult asystem administrator. If the Server System is running properly, a greenicon will appear. If the user double-clicks on the system icon, theapplication will load and the main screen will appear.

Each time the integrated system is launched, a user must supply a log-inname and password before the main screen and all of the windows appear.

Log-In Procedure

-   1. Type the log-in name and password into the appropriate fields.-   2. Click the Advanced button.-   3. In the Server area of the Login dialog, select the Computer and    Database from which wafer records will be obtained for use with the    integrated system. The available and appropriate choices will vary    depending on the user's system configuration.-   4. Click OK.

A user may update a log-in password any time.

User Interface

The user interface has three main windows, as shown in FIG. 4.

Utility Window

The Utility Window 20 appears at the upper left of the display shown inFIG. 4. Tabs allow the window display to toggle between wafer data andlists of user-defined “layouts” specifying datasets and outputs (wafermaps, charts, reports). Icons allow toggling among the various reporttypes and specifying whether wafer data values are displayed numerically(“Extended Data” mode) or graphically as thumbnail images (“Gallery”mode).

Analysis Window 22 Display Area

Depending on the information that is currently being displayed, the workarea on the right side of the display of FIG. 4 will contain the WaferMap, Report or Chart Window.

Detail Window 24

Still in FIG. 4, Detail Window 24 appears on the bottom of the displayshown in FIG. 4. Tabs allow for toggling between display of waferproperties and data, thumbnail previews of graphical wafer maps, anddiagnostic and task status information.

The Utility Window 20

The Utility Window 20 is used to manipulate the wafer maps, reports andcharts that are displayed in the Analysis Window 22. The Utility Window20 includes the Wafers, Layouts and Legends tabs 26.

Wafers Tab

In the Wafers 26 tab, wafer data or thumbnail previews of wafer maps maybe viewed, wafers sorted, wafers selected for view in the AnalysisWindow 22 Display Area, or a single wafer or a group of wafers may beselected to view in the Wafer Display Area. The Wafers 26 tab displaysthe current wafer dataset in either Classic Gallery Mode, Group GalleryMode, Multi Dataset Gallery Mode or Extended Data Mode, as describedbelow.

As shown in FIG. 5, Classic Gallery Mode displays the dataset as aseries of thumbnail images, providing immediate visual representation ofthe wafer maps within the dataset.

As seen in FIG. 6, Group Gallery Mode displays the dataset as a seriesof thumbnail images as in the Classic Gallery, but provides theadditional capability of grouping wafers based on a key parameter. Acolumn 30 is created for each unique value for the selected groupingparameter, and wafers are grouped with common values for the selectedparameter into the same column.

With reference now to FIG. 7, Multi Dataset Gallery Mode displays two ormore datasets simultaneously. This can be used as a convenient way ofselecting wafers or for correlation between multiple scans using anoptional Correlation toolbox.

Turning now to FIG. 8, Extended Data Mode (also called “List” Mode)provides the viewing of data associated with each wafer, in tabularform. This feature can be useful when a user is searching for specificinformation within a set of wafers. Extended Data Mode also allowssorting the entire dataset according to any included data field 32. Inaddition, multiple data fields 32 may be used to perform accumulativesorting.

In FIG. 9, The Layouts 34 tab displays lists of user-defined inputs(datasets) and outputs (wafer maps, charts, reports, activities) thatare stored in the database. A user may select a layout type to view allof the layout names for that type (as well as who created each layout).From here, a user can view, edit or launch a selected layout.

Still in FIG. 9, The Legend Filter 36 tab displays bin counts and valuesto assist in interpretation of the currently displayed site, defectdensity or nanotopography wafer map.

Toolbars and Menus

The Toolbar

The Toolbar contains all of the icons necessary to perform data analysisfunctions. The toolbar is divided into groups, according to the type ofinformation it will display. I cons are provided for accessing thefollowing functions:

Function:

-   Create Dataset filters the wafer database according to    user-specified date ranges, measurement values and other    requirements.-   Create Batch allows the building and running of a list of tasks,    each pairing a selected dataset layout with a selected wafer map,    chart or report layout.-   Login/Logout User: Two icons allow a user to log into and out of the    application. When a user is logged into the application, the first    icon appears grayed out and vice versa.-   Open Document displays a wafer map, chart, report or other image or    data file generated by the system.-   Save saves the layout for the currently displayed item (wafer map,    chart, report or activity).-   Print prints the currently displayed item.-   Email attaches the currently selected item to an email message that    a user can preface and distribute as needed.-   Cut Cuts the current item.-   Copy copies the current item (typically, a wafer map, chart or    report) to allow pasting into another application.-   Paste pastes a copied item into the selected area-   Properties displays the layout settings for the selected wafer map,    chart, report or activity.-   Options configures which windows and tabs are visible in the user    interface. Although most options configured here should generally    remain at their factory settings, a user should specify the desired    destination for output files in the Options dialog's Directories    tab.-   Export Document outputs and optionally displays the content of the    current wafer map, chart or report as a PDF or CSV file.-   Close Window closes the selected Analysis Window item.-   Cascade Windows arranges all Analysis Window items such that they    are overlapped and all titles display.-   Tile Windows arranges all Analysis Window items such that all items    are displayed in their entirety but scaled to fit the available    Analysis Window size.-   Activity Designer Zoom In Used: When editing a complex activity,    this allows a user to zoom in to see more detail.-   Activity Designer Zoom Out Used: When editing a complex activity,    this allows a user to zoom out to see more of the activity's node    objects.-   Activity Designer Compile converts the activity designer elements to    usable code, checking for errors.-   Activity Designer Run compiles the current activity, and performs    the current activity (if no compile errors are found).-   Activity Designer Dataset Node adds a dataset node to the activity    being edited. Editing the node properties allows a user to select    the desired layout.-   Activity Designer Decision Node adds a decision node to the activity    being edited.-   Activity Designer Report Node adds a report node to the activity    being edited. Editing the node properties allows selection of a    desired layout.-   Activity Designer Chart Node adds a chart node to the activity being    edited. Editing the node properties allows selection of a desired    layout.-   Activity Designer Wafer Node adds a wafer map node to the activity    being edited. Editing the node properties allows selection of a    desired layout.-   Activity Designer Email Node adds an email node to the activity    being edited. Editing the node properties allows a user to create a    message, define attachments and select recipients.-   Activity Designer Printer Node adds a printer node to the activity    being edited. Editing the node properties allows selection of an    available printer.-   Activity Designer Status Node adds a status message node to the    activity being edited. Editing the node properties allows a user to    customize the popup message.    Menus

Most of the operations that can be performed using the Toolbar are alsoavailable from menus on the menu bar of the system screen. There aresome operations that can only be accessed from the menus. A briefsummary of the menu item functionality follows in the table below:

File

-   Create Batch Builds and runs a list of tasks, each pairing a    selected dataset layout with a selected wafer map, chart or report    layout.-   Create Dataset Filters the wafer database according to    user-specified date ranges, measurement values and other    requirements.-   Create Dataset Displays a wafer map, chart, report or other    generated image or data file.-   Save Saves the layout for the currently displayed item (wafer map,    chart, report or activity).-   Export Outputs and optionally displays the content of the current    wafer map, chart or report as a PDF or CSV file.-   Print Prints the currently displayed item.-   Send To Attaches the currently selected item to an email message    that a user can preface and distribute as needed.    Edit-   Undo, Cut, Paste-   Copy Copies the current item (typically, a wafer map, chart or    report) to allow pasting into another application.    View-   Bars Several options allow a user to customize the display.-   & Windows-   Properties Displays layout settings for the selected wafer map,    chart, report or activity.    Tools-   Options Configures which windows and tabs are visible in the user    interface. Although most options configured here should generally    remain at their factory settings, a user should specify the desired    destination for output files in the Options dialog's Directories    tab.    Window-   Close Closes the selected Analysis Window item.-   Close All Closes all Analysis Window items.-   Cascade Arranges all Analysis Window items such that they are    overlapped and all titles display.-   Tile Arranges all Analysis Window items such that all items are    displayed in their entirety but scaled to fit the available Analysis    Window size.    The Analysis Window 22

Turning now to FIG. 10, the Analysis Window 22 displays the outputs thatare generated from the dataset and other selected layouts. It candisplay wafer maps 40, reports 42 and charts 44 of single wafers,composite wafers, and site flatness distribution. This window is alsowhere a user can edit Activities that automate the creation (anddistribution) of datasets, wafer maps, reports and charts.

The Detail Window 24

The Detail Window 24, shown in FIG. 4, at the bottom of the displayincludes tabs that allow a user to look at specific informationpertaining to the current dataset and modify the wafer map display.

Properties Tab:

The Properties 50 tab, shown in FIG. 12, displays the availableinformation about the wafer currently selected in the Utility window 20or the item (wafer map, report or chart) currently selected in theAnalysis window 22, of FIG. 4.

Attributes Tab

The Attributes 52 tab, shown in FIG. 13, provides controls allowing auser to change the display properties of the currently displayed wafermap, report or chart.

Data Tab

The Data 54 tab, shown in FIG. 14, provides additional layoutinformation, measurement values or bin values to assist in theinterpretation of the currently displayed chart.

Views Tab

The Views 56 tab, shown in FIG. 15, presents thumbnail buttons allowinga user to view the current wafer map using the selected wafer map modeand data selection. Click a button to change the current wafer map.

Tasks Tab

Depending on the number of data files in a database, the location of thefiles (local or network) and the speed of the computer, many of thesystem operations may take a while. The Tasks 58 tab of FIG. 15, reportsthe status of all system operations so that a user knows when actionsare completed successfully.

Log Tab

The Log 60 tab of FIG. 15 displays error messages contained in the logfile generated by System. Information contained here may be valuablewhen troubleshooting.

Querying

A Dataset is a collection of wafer data files that will be used togenerate wafer maps (graphs), charts and reports. The graphic userinterface “GUI” for creating a Dataset is on analysis system 06 in theembodiments shown. A Dataset is created using a query system in whichcriteria are specified to create a repository of saved wafer datasetlayouts, each which can be-edited or used for wafer analysis work.

Dataset layouts, containing the query criteria and display parametersused to generate the datasets, may be saved as layouts, but theresulting dataset cannot be saved or persisted. Dataset layouts areexportable to other users. Query Search eliminates the need to rememberwhere the data is stored.

The definition used to create a dataset includes criteria that specifythe following:

-   -   when the wafers had to have been measured    -   required metrology values    -   various wafer- or process-related information

Thus, queries may be based on keys, such as product, lot, tool,operator, cassette, wafer, or User Scan. They can specify a fixed daterange (such as wafers created on a specific date, yesterday, last month,within the last n days) or they can specify a relative date range (suchas wafers created between to specific dates). Data values (such as COPdefect counts or scratch counts above or below a specified number orwithin a specified range) may be specified in Boolean expressions.

Dataset Dialog

The Create Wafer Dataset, Edit Dataset Layout and New Dataset Layoutdialog boxes define criteria determining which wafers will be includedin the dataset. This can be based on when the wafer was measured,acceptable wafer measurement thresholds, and/or other associated recordsin the data file.

The dataset layout can be specified using either a fixed or relativedate range. The relative date range provides the flexibility of allowingthe same criteria to produce different results at different times (theactual date range can vary; new wafers meeting the other criteria mayhave been added; older wafers may have been purged from the database).

With reference now to FIG. 16, the Create Wafer Dataset dialog box,available by using the Create Dataset icon or by selecting File>CreateDataset from the menu, is ideal for quickly creating a dataset forone-time use in FIG. 4's Utility Window 20's Wafers 26 tab galleries.

The Edit Dataset Layout and New Dataset Layout dialog boxes, availablein the Utility Window 20's Layouts 26 tab (of FIG. 4), allow a user toalso name and edit re-usable Dataset Layouts. Users can run an existingdataset layout, modify its criteria, or define new criteria to create anew dataset.

Returning to FIG. 16, the Dataset dialog, the name for which variesdepending on how a user accesses it (Create Wafer Dataset, New DatasetLayout, or Edit Dataset Layout), lets a user specify criteria forcreating datasets from the wafers in a database. The Dataset dialog isdivided into areas for narrowing a search based on when the wafers hadto have been measured and what the required measurement and other datavalues are. The Fields 62 button allows a user to specify which waferdata values will appear in the extended data after the search.

Settings available in the Options 64 and Layout 66 buttons allow thesetting of defaults and save and import settings.

Layout 66 Button:

Options in the Layout 66 button of FIG. 16 allow a user to save andrecall query settings.

Copy From

When creating a new dataset layout, click this option to import thequery settings from an existing dataset layout. In the Copy From dialog,click the desired layout and click OK. (A user can also right-click alayout and select Edit if he or she wants to inspect a particularlayout's settings.) All of the query settings in the current query orlayout are updated to match the selected layout.

Save As

This is an alternative method to simply clicking on OK to save a datasetlayout. If a user is editing query criteria for a dataset that is not anamed layout, this is the only way to save it as a named layout withre-usable settings.

Dataset Dialog's Options Button

Still in FIG. 16, the Create Wafer Dataset, New Dataset Layout and EditDataset Layout dialogs used to create and edit dataset layouts have anOptions 64 button allowing for the control of the wafers and dataparameters that can appear in a dataset, and setting of defaultparameters that will be used whenever new datasets are created.

Max Number of Rows

A user may click this item to access another dialog box allowing settinglimits on the number of wafers that can be included in a single datasetand the number of wafers that can be included in a composite. Increasingthe default values allows the viewing of more data, but may adverselyaffect system performance and risks attempting to process more data thancomputer system resources allow.

My Default Wafer Fields

If a user finds that the Dataset dialog's Fields 62 button are used torequest the same parameter set often, a user can specify a defaultsetting that will be used for all future datasets. This is configuredusing the same method as Wafer Fields described above.

Reset 68 Automatically

This parameter determines whether the settings in all of the querydialogs are reset to include no filtering upon the start of a new query.Setting this to checked ensures that a user is starting fresh each timea new dataset is created. Setting this to unchecked keeps the settingsthat were in effect for the last dataset query that was used. This ishelpful if several similar datasets need to be created.

Specifying Dataset Fields

Wafer Fields

When editing query settings for a new dataset or an existing datasetlayout, a user can specify which wafer fields are reported in Utilitywindow 20's Wafers 26 tab, shown in FIG. 4, when Extended Data mode isselected. The Wafer Fields order also determines which fields areincluded in each of the thumbnails for Classic Gallery, Group Galleryand Multi Dataset Gallery.

-   1. Returning to FIG. 16 access the Dataset dialog for the dataset    being created or the layout being edited.-   2. Click the Fields 62 button to access the Wafer Fields dialog. The    Available Fields column lists expandable categories of parameters    that can be added to the list of reported fields. The Selected    Fields column lists the currently selected Wafer Fields parameters.    The included parameters and their order are based on either the last    edit of Selected Fields for this dataset or the default setting for    new datasets. (To change the default setting, select My Default    Wafer Fields from the Options button.)-   3. Edit the list as follows:

To remove a Selected Fields parameter from the list, click theparameter, then click the Remove button or press the <Delete> key.

To add a new parameter to the Selected Fields list, click the plus-signfor any Available Fields category, then click the desired parameter,then click the Add button.

To change the order of appearance of items in the Selected Fields list,click a parameter to be moved, then click the up or down arrow above thelist.

Creating a New Dataset

-   1. Click the Create Dataset icon or select File>Create Dataset. The    Create Wafer Dataset dialog box shown in FIG. 16 will appear.

Settings in the upper left portion of the dialog specify which wafers toinclude based on when they were characterized.

Settings in the upper right portion of the dialog specify which wafersto include based on what measurement values or descriptiveidentification strings are in their records.

The window at the bottom of the dialog displays a version of thecriteria that will be converted to SQL code.

-   2. Select Use Fixed Date Range 70 or Use Relative Date Range 72 to    specify a date range. This defines a range of specific dates during    which the wafers had to be measured in order to be included in the    dataset.-   3. Click the Reset 68 button at the bottom of the dialog box. This    ensures that all of the tabbed dialog boxes are restored to their    initial state, with no “filtering” based on wafer parameters.    (Depending on whether other datasets have already been created, some    of these dialogs may already have settings that should be cleared.)-   4. In the series of tabbed dialog boxes at the upper right area of    the Create Wafer Dataset dialog box of FIG. 16, specify the    equipment/process names and wafer measurement value requirements for    inclusion into the dataset. If a user wants to be able to re-use or    edit dataset definitions at a later date, click the Layout 66    button, then select Save As. In the Save As dialog, enter a name for    the dataset and click OK. It is desirable to use descriptive names    that can distinguish datasets from each other. In order to save all    criteria, perform this step only after defining all of criteria.-   5. Click the OK button at the bottom of the dialog.

In the Detail Window 24, of FIG. 4, the Tasks 25 tab will add two newline items to indicate that the dataset was created and report thenumber of records (wafers) that were included. A user may need to clickthe Tasks 25 tab in order to view this.

In the Utility Window 20 of FIG. 4, the Wafers 26 tab will display thewafers defined by this query, and show the Dataset name in the box abovethe wafer data. If the Layouts tab is currently displayed, click theWafers 26 tab to view this.

Dataset Criteria Editing

Returning again to FIG. 16, dataset criteria may be defined in a singledialog box that contains four main areas:

-   -   Name    -   Date Range    -   Wafer Criteria    -   Buttons for Layouts, Options and Fields        Specifying a Dataset Date Range

Still in FIG. 16, two options are available for specifying the range ofdates during which the wafers had to be scanned in order to be includedin the dataset:

Fixed Date Range 70:

Specific starting and ending dates may be specified. Any wafers measuredduring this range that also meet measurement criteria are accepted intothe dataset. This method has the advantage of usually including the samewafers any time the saved dataset layout is run.

Relative Date Range 72

A date range that is relative to the current time (for example, theprevious month) may be selected. Any wafers measured during this rangethat also meet measurement criteria are accepted into the dataset. Thismethod has the advantage of being flexible to include the most recentlyacquired wafer data.

Specifying a Fixed Date Range

-   1. In the upper left area of the Create Wafer Dataset dialog box, of    FIG. 16 click Use Fixed Date Range 70.-   2. Set the Start Date to the desired setting using the following    methods:

Click the currently displayed month to highlight it, then press the upand down arrow keys to increment and decrement the month, respectively.Press the <End> key to set the month to December; press the <Home> keyto set the month to January.

Click the currently displayed day. Similarly, press the up and downarrow keys to increment and decrement the day, respectively. Press the<End> key to select the last day of the month; press the <Home> key toselect the first day of the month. Additionally, a user can type aspecific day value.

Click the currently displayed year, by similarly pressing the up anddown arrow keys to increment and decrement the year, respectively or bytyping a specific year value.

-   -   Click the arrow to the right of the End Date data entry box, and        a calendar will display. Click the right and left arrow buttons        (or press the <Page Up> and <Page Down> keys) to increment and        decrement the month, respectively. Once a user has selected a        month, use the arrow keys to change the date, or simply click a        specific date. However, queries with relative date ranges will        accept different wafers at different times, as older wafers will        no longer be included in the range.

-   3. Similarly, set the End Date.

-   4. Edit the wafer measurement criteria, or click OK to immediately    create a dataset with the current date range and wafer measurement    criteria.    Specifying a Relative Date Range 72

1. In the upper left area of the Create Wafer Dataset dialog box of FIG.16, click Use Relative Date Range 72.

-   2. In the Wafers Created 76 box, select one of the following    methods:

In the last: Select a certain number of days, weeks, months or yearsbefore and including a specific date (for example, in the last 3 monthsbefore Jan. 10, 2001). Use the arrows to the right of the boxes todetermine the interval, then select the target date using the methodsdescribed below.

In the following: Select a certain number of days, weeks, months oryears after and including a specific date. Use the arrows to the rightof the boxes to determine the interval, then select the target dateusing the methods described below.

Today: Select wafers measured today.

Yesterday: Select wafers measured yesterday

This week: Select wafers measured from the most recent Saturday (whichcould be today) through the and including next Friday (which could betoday). Refer to the code at the bottom of the dialog box for the exactdates.

Last week: Select wafers measured during the 7-day period ending theprevious Friday. Refer to the filter logic description at the bottom ofthe dialog box for the exact dates.

This month: Select wafers measured between the first and last days ofthe current month. Note that saving and re-using this criterion willproduce different results as new wafer records get created throughoutthe month.

Last month: Select wafers measured between the first and last days ofthe previous month.

This year: Select wafers measured between the first and last days of thecurrent year. Note that saving and re-using this query will producedifferent results as new wafer records get created throughout the year.

Last year: Select wafers measured between the first and last days of theprevious year

-   3. Edit the wafer measurement criteria, or click OK to immediately    create a dataset with the current date range and wafer measurement    criteria.    Specifying Wafer Criteria

A user has complete control over determining which wafers will beincluded in the dataset. Acceptance can be limited to particular processnames or recipes, cassette or other equipment values, and anycombination of measurement value ranges among the available IndividualMeasurement Printouts (IMPs) and defect data values. The process ofnarrowing down the dataset of wafers for analysis is sometimes referredto as “filtering”.

In the selection criteria, a user also has the option of creating“Composite” wafers, which average and combine the measurement data forseveral wafers having common values for one or more designated fields.This creates a smaller dataset allowing quick comparison of trends amongwafers with various combinations of key attributes.

Specifying Key Criteria

The Key 78 tab of the Create Wafer Dataset dialog box of FIG. 16 allowsa user to “filter” (restrict) the acceptable wafers to those measuredfrom particular products, processes, ingots or cassettes. Users can alsofilter by specific operators, or sample subsets from many lots byselecting specific wafer numbers.

-   1. Click the Key 78 tab.-   2. Select one of the available parameters 80, and click the arrow    button 82 to the right of its text entry box.-   3. From the popup context menu, select Browse. All available values    from the database are displayed for the selected parameter based on    the other criteria that have already been selected. (For example, if    only wafers from last week are included, any operators used only    prior to that time will not be included.)-   4. From the list of available values, click any that are desired for    the dataset. More than none may be selected.-   5. Click OK 74. The criteria are automatically entered into the text    entry box. If multiple entries were selected, they are separated by    “OR”. Note that the text (that will later be converted to SQL code)    displayed in the large box 84 at the bottom of the Create Wafer    Dataset dialog box of FIG. 16 is also modified.-   6. If necessary, edit the text entry. For example, a user may wish    to place parentheses around the entire entry and precede it with    “NOT”. This would cause all values within the parentheses to be    excluded. If the user has an application where specific entries    should always be excluded, this approach is preferable to simply    listing the entries to be included, because it allows the same    selection to be used even after new acceptable entries become    available.-   7. Repeat the process from step 2 for any other parameters to be    used as filters. If multiple parameters are selected within this    dialog box, only wafers satisfying all of the filters (as well as    other criteria defined throughout the Create Wafer Dataset dialog    box) will be included in the dataset.    Specifying Composite Wafers

Still in FIG. 16, the Composite 86 tab of the Create Wafer Datasetdialog box allows the creation of a dataset that includes “compositewafers”. Each composite wafer combines the measurement results ofseveral wafers, yet may be treated as a single wafer in the UtilityWindow 20's wafer gallery or list. This is a good way to take a verylarge dataset and reduce it to a smaller number of records based on asingle variable or multiple variables (related to process, equipment,time, operator, recipe).

Composite analysis, which combines data from different scans and evendifferent tools, allows for combining data in new ways, allowing trendsand patterns not otherwise apparent.

-   Composite wafer analysis: Multiple wafers may be overlaid to provide    composite wafers with which defect patterns may be identified.    Hundred of wafers may be combined in order to identify systemic    patterns. Wafer composites may be scheduled to run in the background    of the Server and the Client.-   Composite data analysis: With the ability to read not only CSV files    but also ADM (binary) files, data such as defect data may be    superimposed on a map such as a haze map.-   Multi-wafer metrics and statistics: Average, Min, Max, and Standard    Deviations, Totals, and others may be calculated for selected wafer    characteristics.

Creating composites allows immediate assessment of trends related to anycombination of variables. For example, wafer data for different shiftsin a workday could be grouped and compared to see how each shift's datavaries. Further, a user could investigate whether variances were due tothe time of day or the difference in personnel by comparing data run bythe same individuals in the different shifts.

-   1. Click the Composite 86 tab of FIG. 16.-   2. Click inside the Composite Dataset box to place a checkmark and    activate the composite keys.-   3. Click the arrow button to the right of the Group By box, then    select a parameter. If a user chooses not to select any of the    remaining Then By boxes, one record will be created for each    different value in the database for the selected parameter. If a    user chooses Then By selections, one record will be created for each    unique combination.-   4. Because composite datasets are typically created to simplify the    data for a very large number of wafers, the user has the option of    deciding whether to include only statistical data or all of the    required wafer data to create wafer maps. Unless a user needs to    create wafer maps, set the Get Wafer Map Information box unchecked    to greatly reduce the processing time to create the dataset. From    the list of available values, click any to be included in the    dataset.-   5. Click OK. The criteria are automatically entered into the text    entry box. Note that if multiple entries were selected, they are    separated by “OR”. Note that the text (that will later be converted    to SQL code) displayed in the large box at the bottom of the Create    Wafer Dataset dialog box will be modified.    Specifying Tool 88 and Recipe Criteria

The Tool 88 tab of the Create Wafer Dataset dialog box of FIG. 16 allowsa user to restrict the acceptable wafers to those measured on specificmetrology tools or using only a specific recipe.

-   1. Click the Tool 88 tab.-   2. Select one of the available parameters, and click the arrow    button to the right of its text entry box.-   3. From the popup context menu, select Browse. All available values    from the database for the selected parameter based on the other    criteria that have already bee selected will be displayed. For    example, if a user only included wafers from one Process, any Tools    used only for other processes will not be included.-   4. From the list of available values, click any to be included in    the dataset.-   5. Click OK 74. The criteria into the text entry box are    automatically entered. If multiple entries were selected, they are    separated by “OR”. The text (that will later be converted to SQL    code) displayed in the large box 84 at the bottom of the Create    Wafer Dataset dialog box of FIG. 16 is also modified.-   6. If necessary, edit the text entry. For example, a user may wish    to place parentheses around the entire entry and precede it with    “NOT”. This would all values within the parentheses to be excluded.    If the user has an application where specific entries should always    be excluded, this approach is preferable to simply listing the    entries to be included, because it allows the same selection to be    used even after new acceptable entries become available.-   7. Repeat from step 2 for any other parameters to be used as    filters. If multiple parameters within this dialog box are accepted,    only wafers satisfying all of the filters (as well as other criteria    defined throughout the Create Wafer Dataset dialog box) will be    included in the dataset.    Specifying Wafer Criteria Using Expression Editor

Still in FIG. 16, in the Expression 90 tab of the Create Wafer Datasetdialog box, a user may build one or more logical expressions to filterthe dataset based on IMP values or apply more complex filteringtechniques using the parameters that are also available on the othertabs.

-   1. At the upper right area of the Create Wafer Dataset dialog box,    click the Expression 90 tab.-   2. Click the Add button to add a new expression, launching the Build    Expression dialog box.-   3. In the Build Expression dialog box, click the arrow button to the    right of the Field box to view the available field categories.-   4. Double-click one of the categories (or click the plus sign to the    left of it) to display all of the available fields within the    category.-   5. Use the scroll bar to view all of the available fields within the    category, then click the field to be used in the expression. NOTE:    Do NOT click the OK button yet.-   6. Click the arrow button to the right of the Operator box to view    the available operators, then click one.-   7. Type the appropriate value in the Value box, then click OK. The    expression appears in the window.-   8. To add another expression, repeat steps 2 through 7. Note that    this second expression appears in the window and that the operator    “AND” appears to the right of the first expression. This means that    both expressions must be true (as must all of the conditions defined    in other tabs) in order for the wafer to be accepted into the    dataset. To change the requirement such that only one of the two    expressions must be true, click either expression, then click the    AND button at the lower right of the dialog box to toggle the    operator to “OR”.-   9. Click OK 74.    Loading an Existing Dataset

After creating and saving named datasets, a user can quickly load onefor analysis at any time.

-   1. In the Utility Window 20 shown in FIG. 4, click the Layouts 26    tab.-   2. Click the arrow button above the layout list to select Datasets    layouts.-   3. From the list of Datasets, right-click the desired Dataset, then    select Run.

The number of wafers in the dataset and the processing time required toload them depend on the query's filtering criteria. In the Detail Window24, click the Tasks 25 tab to monitor the dataset loading progress andsee how many wafers were loaded. Note that the wafers included in thedataset may vary if the query includes a relative date range or ifrecords were added to or removed from the wafer database.

Wafer Maps and Wafer Map Layouts

Wafer maps provide an immediate visual representation of waferthickness, flatness, shape, defect particles, defect density and otherwafer properties. A variety of display options allow viewing of wafersin color or greyscale, in numerical or graphical format, and from a topview or in three-dimensional space from any angle. In addition,“composite” wafer maps, combining several wafers into a single map, maybe created.

-   For dimensional data composite wafer maps, the results are displayed    in the map by taking the data points from the selected wafers and    applying mathematical operation of a user's choosing, such as    addition or averaging or standard deviation.-   For defects composite wafer maps, compositing includes all of the    defects from the wafers included. Mathematical compositing is    performed only for user-defined rings, sectors and regions.    Creating and Editing Wafer Maps    Creating a New Wafer Map

Use either of these methods to start creating wafer map settings in anew wafer map layout.

To Create a New Wafer Map Layout for Future Use

-   1. In the Utility Window 20 of FIG. 4, click the Layouts 26 tab.-   2. Using the arrow button, select Wafer Maps layouts.-   3. Right-click anywhere in the Utility Window, then select New.-   4. Edit the wafer map layout, as described in Editing Wafer Map    Layout General Parameters and Editing Wafer Map Layout Parameters,    described below.

To Create a New Wafer Map Layout for Immediate Use on Selected WaferItems

-   1. In the Utility Window 20's Wafers tab, select the wafer or wafers    to be included in the wafer map.-   2. Right-click, then select Wafer Map>Run With Selected Layout from    the context menu.-   3. In the Run With Selected Layout dialog, click the Options button,    then select New.-   4. Edit the wafer map layout, as described in Editing Wafer Map    Layout General Parameters and Editing Wafer Map Layout Parameters,    described below.-   5. After configuring a new layout's settings, a user would click the    new layout name from Run Wafer Map With Selected Layout list, then    click OK. The wafer map is displayed using the selected wafer    records and wafer map layout settings.    Editing Wafer Map Layout Settings

Access to the dialog box that contains wafer map layout parameters maybe accomplished three different ways. The best method to use depends onthe situation:

-   creating or editing a wafer map layout for future use-   creating or editing a wafer map layout for immediate use after    selecting wafers-   adjusting the currently displayed wafer map

Create/Edit a Layout for Future Use

This method, which creates a wafer map layout but does not create themap itself, is best when making offline changes to several layouts orwhen creating or editing layouts that will be used at a later time. Bynot producing the maps on screen each time the layout is created, a useravoids having to wait while data are processed.

-   1. In the Utility Window 20 of FIG. 4, click the Layouts 26 tab.-   2. Click the arrow button above the layout list to select Wafer Maps    layouts.-   3. From the list of wafer map layouts, right-click the desired    layout and select Edit. If creating a new wafer map layout,    right-click somewhere below the list of layouts and select New.

Using the Edit Layout or New Layout dialog shown in FIG. 17, edit thewafer map layout settings, as described in Editing Wafer Map LayoutParameters, described below.

Create/Edit a Layout for Immediate Use

This method selects and edits an existing wafer map layout, then createsa wafer map using the currently selected wafers in the currentlyselected dataset. If individual wafers are not selected, the entiredataset will be used.

-   1. Create a new dataset or load an existing dataset.-   2. In the Utility Window 20 of FIG. 4, click the Wafers tab 26 to    display the dataset.-   3. Highlight the wafer of interest. Multiple wafers may be selected    by clicking on individual records in the extended data wafer list or    by clicking on individual thumbnails in the gallery. Use the <Shift>    and <Ctrl> keys to select multiple wafers. To include all of the    wafers in the dataset, right-click and select Select All.-   4. Make sure the cursor is on one of the selected wafers, then    right-click and select Wafer Map.-   5. If multiple wafers are selected, note the item Composite Selected    Wafers, whose setting (indicated by the presence of a checkmark) can    be changed the opposite setting by clicking on this item. Set this    item to checked if combining all of the wafers into a single wafer    map. Set this item to unchecked if a separate wafer map for each    wafer selected is desired. If a large number of wafers are selected,    there may not be enough system resources be able to process all of    the maps.-   6. Place the cursor on one of the selected wafer or wafers, then    right-click and select Wafer Map>Run With Selected Layout.-   7. From the list of wafer map layouts, right-click the desired    layout and select Edit.-   8. Using the Edit Layout dialog of FIG. 17, edit the wafer map    layout settings, as described in Editing Wafer Map Layout    Parameters, as described below.

Updating a Displayed Wafer Map

This method edits the currently displayed wafer map (but does not updatethe wafer map layout).

-   1. In the Analysis Window 22 of FIG. 4, click the wafer map to be    edited.-   2. Click the Properties icon or select View>Properties.-   3. Using the Edit Layout dialog of FIG. 17, edit the wafer map    layout settings, as described in Editing Wafer Map Layout    Parameters, as described below. After updating a displayed wafer    map, chart or report item, click the displayed item in the Analysis    window, then select File>Save.

Once the New Layout or Edit Layout dialog box of FIG. 17 is launched, auser can define all aspects of wafer map content and formatting. Notethat a wafer map layout cannot select which wafers will be reported. Thedialog box for editing wafer map layouts includes two tabbed dialogs:General 90 Tab and Layout Parameters 92 Tab,

Editing Wafer Map Layout General Settings

Still in FIG. 17, settings in a wafer map layout's General 90 tabspecify the layout's name, title and a brief description. In the NewLayout or Edit Layout dialog, click the General 90 tab.

-   Name: This field allows a layout descriptive name that is 30    characters or less.-   Description: This field allows a description of the layout's    purpose, detailed instructions for users, or any other helpful    information. The notes and comments entered here are for personal    use and will not be included in the actual wafer map display. This    is a good place for a user to enter any notes that will other users    to distinguish the layout from other available layouts, or which    datasets are intended to be used with the layout.-   Title: Specify a title that will appear at the top of all wafer maps    created with this layout.    Editing Wafer Map Layout Parameters

Still in FIG. 17, a single dialog box in the wafer map layout's LayoutParameters 92 tab allows specification of all content and displaydetails which define the wafer map.

Wafer—Background Data

Click inside the selection box, then use the arrow button to the rightof the selection box to specify the dimensional measurement surface orproperty that will be displayed in the wafer map. Options include:

-   [hide] Displays no background data. Selecting this option is    typically done only to display particle defects with no background.-   Dim To display thickness, the map reports the deviation of all    points-   Thickness on the frontside surface from the ideal backside reference    plane. Note that all points are adjusted mathematically to simulate    a chucked state (i.e., applied vacuum makes the wafer backside    perfectly flat).-   Dim The map reports the deviation of all points on the frontside-   Flatness3PT surface from the three-point global reference plane. All    points are adjusted mathematically to simulate a chucked state    (i.e., applied vacuum makes the wafer backside perfectly flat).-   Dim The map reports the deviation of all points on the frontside-   FlatnessBF surface from the best fit global reference plane. Points    are adjusted mathematically to simulate a chucked state (i.e.,    applied vacuum makes the wafer backside perfectly flat).-   Dim The map reports the deviation of all points on the median-   Warp3PT surface from the three-point median reference plane. Values    for this measurement are for the wafer in an unchucked state.-   Dim WarpBF The map reports the deviation of all points on the median    surface from the best fit median reference plane. Values are for the    wafer in an unchucked state.-   Dim SORI The map reports the deviation of all points on the    frontside surface from a best fit reference plane fitted to the    frontside surface with the wafer in an unchucked state.-   Dim STIR, This map mode provides a gridded display of the individual-   Dim SFPD sites on the wafer, with site flatness (STIR or SFPD)    measurements and “go”/“no-go” status for each site. See Site Map    below for more details.-   Defect The map displays the density of defects on the wafer surface-   Density within previously defined rings and sectors.-   SQM Height The map displays the wafer nanotopology.    Wafer—Background Format

Click inside the selection box, then use the arrow button to the rightof the selection box to specify the desired graph format. Availableoptions include:

2D Surface Contour mode, as shown in FIG. 18, offers a two-dimensionalview of the wafer's front side or median surface, depending on theselected Data. Optionally configured contour lines or bands of colorconnect points of equal values (for contour lines) or ranges (for colorbands). Values in the map represent one of the following: thickness,deviation of the chucked wafer's top surface points from the selectedfocal plane (FPD, deviation of the chucked wafer's top surface pointsfrom the selected focal plane (Sori), variation from the median surfaceto the median reference plane (Warp) or SQM height.

3D Surface Contour mode, as shown in FIG. 19, offers a three-dimensionalmodel of the wafer's front side or median surface, depending on theselected Data. Using the mouse pointer, a user can drag on theinteractive display to change the angles of rotation, adjust the zoom,or cause the wafer to spin in 3D space.

Cross Section mode, as shown in FIG. 20, displays a plot of SQM height,wafer thickness, flatness (focal plane deviation from the selected bestfit or three point reference plane), or shape (for Warp, median surfacedeviation from a best fit or three point median reference plane) (forSori, unchucked front surface deviation from a best fit front sidereference plane) along a user-specified cross-section. The angle for thecross section “slice” is set in the Layout Parameters 92 dialog's CrossSection—Angle item described below. After the map is displayed, a usercan use the mouse pointer to drag on the arrow in the interactivedisplay, continuously changing the slice angle.

Site Map mode, as shown in FIG. 21, provides a gridded display of theindividual sites 94 on the wafer, with site flatness (STIR or SFPD)measurements and “go”/“no-go” status for each site. All site measurementvalues are compared against a threshold value that was supplied in thedata acquisition or reprocessing recipe. Sites whose values that arewithin tolerance are displayed in green; sites whose values that out oftolerance are displayed in red. The sites whose values are closest tothe threshold value are shaded the lightest; sites whose values arefurthest from the threshold value (either within or out of tolerance)are shaded the darkest. Note that all site configuration parameters(i.e., site size, grid and row offsets, whether partial sites aredisplayed) are as specified in the recipe that was used during dataacquisition or reprocessing.

Defect Rings mode, as shown in FIG. 22, presents a series of previouslydefined concentric rings 100 which are colored according to the wafer'sdefect density. Ring definitions are specified in the configurationusing Microsoft Management Console (MMC). Each ring is assigned a singlecolor based on the density for the region. For composite wafer maps,each ring is colored according to the method selected in the layout'sComposite Operation.

Defect Sectors mode, as shown in FIG. 23, presents a series of “pieslices” which are colored according to the wafer's defect density. Eachsector 102 is assigned a single color based on the density for theregion. For composite wafer maps, each sector is colored according tothe method selected in the layout's Composite Operation. Sectorsdefinitions are specified in the configuration using MicrosoftManagement Console (MMC).

SQM Height Threshold mode, as shown in FIG. 24, presents SQM thresholdcurves for each defined bin, showing all of the corresponding percentagearea failed values for varying height change threshold values.

Wafer—Regions mode, as shown in FIG. 25, displays wafer defects inuser-created regions that are defined previously in the configurationusing Microsoft Management Console (MMC). Click inside the selectionbox, then use the dropdown menu arrow button to the right of theselection box to specify the desired setting. Available options include:

[hide]

-   Density with Black Outline-   Density with Highlighted Outline-   Outlined with Black-   Outlined with Density Color-   Outlined with Highlight Color

Wafer—SQM Failed Bins: When set to [show], this parameter colors pixelsin the wafer map red if the SQM height variation exceeds one or more“bins” of user-selectable distance and threshold values. All unaffectedpixels will remain as specified by the Wafer—Background Data andWafer—Background Format settings. Click on the displayed current settinginside the selection box to toggle it to the opposite setting. A usershould set this parameter to [hide] unless wafer data includes SQMfailed bin data.

Wafer—Defects Particles: Setting this parameter to a selection otherthan [hide] allows a view of defects particles, colored according to avariety of options to enhance interpretation of the defect data. Notethat the displayed particles appear over whichever wafer data isdisplayed according to the Wafer—Background Data and Wafer—BackgroundFormat settings. A user would click inside the selection box, then usethe arrow button to the right of the selection box to specify thedesired setting. Available options include:

-   [hide] Does not display defects.-   Bin Colors each defect according to which user-defined bin it was    sorted into. Bins are defined in the configuration using Microsoft    Management Console (MMC).-   Bin (True Size) Colors each defect according to the size as    determined by the True Size Algorithm, part of the optional    Toolboxes: ThinFilms and Correlation.-   Channel Colors each defect according to the gage channel on which it    was detected: Back, Front, Center, Extinction, Radial, Tangential or    Other.-   Defect Type Colors each defect according to its type: Point, Line,    Area, or Other. Note that scratch defects are classified as Line.-   Lost Common Intended for 2-wafer composite wafer maps, this option-   Adder colors each defect according to whether it was present only on    the first wafer (Lost), present on both wafers (Common), or present    on only the second wafer (Adder). If more than two wafers are    selected, only uses the first two wafers.-   Material ID Color each defect according to the Material ID as    determined by the True Size Algorithm, part of the optional    Toolboxes: ThinFilms and Correlation.-   Monochrome Displays all defects using the same color.-   Wafer Scan Intended for composite wafer maps, this option colors    each defect according to the wafer on which it was present.

Reverse Wafer Scan Order: This parameter selects the order and layeringfor wafer map display when multiple wafers are selected and compositingis not selected. A user would click the displayed current setting insidethe selection box to toggle it to the opposite setting.

-   No causes the first of the wafers selected in the Wafers tab to be    drawn first and the last (bottom-most) wafer to be drawn last. This    results in the last wafer at the top of the “stack” of wafer maps.-   Yes causes the last of the wafers selected in the Wafers tab to be    drawn first and the first (top-most) wafer to be drawn last. This    results in the first wafer at the top of the “stack” of wafer maps.

Composite Operation: A user would click inside the selection box, thenuse the arrow button to the right of the selection box to specify one ofthe following compositing methods to be used when multiple wafers areselected and compositing is selected. Available options include:

-   Average Each point on the displayed surface is the average for that    point among all of the wafers in the composite.-   Minimum Each point on the displayed surface reports the lowest value    for that point among all of the wafers in the composite.-   Maximum Each point on the displayed surface reports the highest    value for that point among all of the wafers in the composite.-   Standard Each point on the displayed surface reports the calculated    Deviation standard deviation for that point among all of the wafers    in the composite.-   Subtraction Each point on the displayed surface reports the    difference of values between the first two wafers in the composite.-   Total Each point on the displayed surface reports the sum of all    values for that point among all of the wafers in the composite.

Sampling Factor: Intended for contour maps only, this parameterdetermines the percentage of available data points used when drawingwafer maps, allowing a user to balance processing speed and data mapresolution. Click inside the selection box and type a value between 1and 10. A value of 1 uses all available data values and provides thebest display, but requires the most processing time. A value of 10 usesthe least number of data values and provides the lowest resolutiondisplay, but requires the least processing time. Higher values (i.e.,lower resolution) should be selected when the layout is intended to beused with large data sets and/or 300 mm wafers. For SQM wafer maps, 4 isthe recommended value.

Color Scale mode, as shown in FIG. 26: A user would click inside theselection box, then use the dropdown menu arrow button to the right ofthe selection box to specify a color scale for contour maps. IfWafer—Background Format is not 2D Surface Contour or 3D Surface Contour,this setting is ignored.

-   Red/Blue Applies full color to the map, with red representing the    highest values and blue representing the lowest values. Note that    the range of color is mapped to the Height Range. Any values higher    than the Height Range high value are displayed as red; any values    lower than the Height Range low value are displayed as blue. See    Height Range later in this chapter for more details.-   Grey (Light, Medium, Dark) Draws the map in greyscale. Three choices    allow a variety of darkness options.

Use Banded Color: This item, when activated, displays the selected colorrange as a small set of color values in contour maps. In some cases,this helps a user see the data values in the wafer map more clearly.Click the displayed current setting inside the selection box to toggleit to the opposite setting. If Wafer—Background Format is not 2D SurfaceContour or 3D Surface Contour, this setting is ignored.

-   Yes: Only a subset of the color range is used; wafer measurement    values within specific ranges are assigned specific colors.-   No: The full color range is used; the color for each display point    is based on the relationship between its measurement value and the    selected Height Range.

Show Extension Chart mode, as seen in FIG. 27: This item, when set toYes, attaches a chart 106 to the wafer map, displaying the chart in aseparate window at the lower right of the screen. The chart uses thesame dataset and wafers as the wafer map, and requires a named chartlayout. Click the displayed current setting inside the selection box totoggle it to the opposite setting.

Extension Chart Layout: If a user activated the Show Extension Chartoption above, click inside the selection box, then use the button toselect one of the existing chart layouts. If a user needs to create anew chart layout, a user can click the Select Chart Layout dialog'sOptions button and select New, then select the new layout from the listafter a user edits the settings.

Contour Lines, as shown in FIG. 28: This item, intended for 2D and 3Dcontour wafer maps only, adds lines to the displayed surface connectingpoints of equal deviation from the appropriate reference plane. A userwould click inside the selection box, then use the arrow button to theright of the selection box to select one of the following options:

-   Off Specifies no contour lines.-   Interval Specifies the spacing of the deviation values represented    by-   Method the contour lines.-   Count Method Specifies the number of contour lines displayed in the    wafer map.

Num Contour Lines: This parameter is used for 2D and 3D contour wafermaps when Contour Lines is set to the count method. Click inside theselection box and type a value between 1 and 100.

Contour Interval: This parameter, used for 2D and 3D contour wafer mapswhen Contour Lines is set to the interval method, specifies thedifference in wafer thickness or deviation values between points alongadjacent contour lines. A user would click inside the selection box andtype the desired value. Lower interval settings cause a greater numberof contour lines to be drawn. With extremely low contour intervalvalues, the number of contour lines requested may exceed the capabilityallowed by computer system resources.

Height Range: This parameter selects a range of measurement values thatwill be “mapped” to the selected range of color for 2D and 3D contourmaps. Each wafer point whose measurement value equals or exceeds thehigh value of this range will be drawn red (or the lightest availablegreyscale color). Each wafer point whose measurement value is equal toor less than the high value of this range will be drawn blue (or thedarkest available greyscale color). Any wafer values between this rangeare drawn in a color whose relationship to the color range is the sameas the wafer value's relationship to the Height Range. A user wouldclick inside the selection box, then use the arrow button to the rightof the selection box to specify the following height ranges:

-   Automatic: Wafer map coloring is scaled automatically according to    the data reported in the map (a user does not need to specify user    defined low and high values below). The point with the highest    measurement value is assigned to red (or the lightest available    greyscale color); the point with the lowest measurement value is    assigned to blue (or the darkest available greyscale color). Note    that this method always ensures that every wafer map will use the    full range of color or greyscale. However, points having equal    measurement values may be colored completely differently in    different maps if the range of all measurement values varies from    map to map.-   User Defined: A user selects a custom measurement range to be    applied to the selected color range. Specify the range limits using    the User Defined Low Value and User Defined High Value below.-   ±25, ±50, ±100,±150, ±200: Choose one of the available ranges to    apply to the selected color range (a user does not need to specify    user defined low and high values below). Note that this method may    produce wafer maps that are uniformly colored if all of the    measurement values in the wafer map are outside the selected range.

User Defined Low Value: A user would click inside the selection box andtype the desired value. Any values in the map that are equal to or lowerthan this value will be colored blue (or the darkest available greyscalecolor).

User Defined High Value: A user would click inside the selection box andtype the desired value. Any values in the map that are equal to orgreater than this value will be colored red (or the lightest availablegreyscale color).

Cross Section—Angle: Intended for cross section wafer maps only, thisvalue determines the initial cross-sectional “cut” which bisects thewafer. A user would click inside the selection box and type the desiredvalue. Once the wafer map is displayed, a user can adjust this angleinteractively in the Analysis window. An initial setting of 0 degreesspecifies a cut that starts 180 degrees from the primary fiducial andends at the primary fiducial. The cross section angle increases as auser moves clockwise.

Cross Section—Point to Point: This parameter and the four coordinatesparameters below it allow a user to create a wafer map layout thatdisplays cross section data for a user-configurable cut which does nothave to bisect the wafer or start and end at the wafer edge. A userwould click the displayed current setting inside the selection box totoggle it to the opposite setting.

-   No: Specifies a cross section slice that bisects the wafer, starting    and ending at a wafer edge, with the angle as set by the Cross    Section—Angle parameter.-   Yes: Specifies a cross section slice with starting and ending points    defined by the X From Point, Y From Point, X To Point and Y To Point    coordinate parameters below. The slice's start (“from”) and end    (“to”) points are defined using a Cartesian coordinate system    centered at the wafer center, with the primary fiducial facing    downward. X has a 0 value at the wafer center, with negative values    to the left and positive values to the right. Y has a 0 value at the    wafer center, with negative values below it and positive values    above it.

X From Point: With a cross section wafer map is selected with CrossSection—Point to Point active, this specifies the horizontal coordinateof the starting point for a Cross Section—Point to Point slice. A userwould click inside the selection box and type the desired value, inmillimeters from the wafer center.

Y From Point: With a cross section wafer map selected with CrossSection—Point to Point active, this specifies the vertical coordinate ofthe starting point for a Cross Section—Point to Point slice. A userwould click inside the selection box and type the desired value, inmillimeters from the wafer center.

X To Point: With a cross section wafer map selected with CrossSection—Point to Point active, this specifies the horizontal coordinateof the ending point for a Cross Section—Point to Point slice. A userwould click inside the selection box and type the desired value, inmillimeters from the wafer center.

Y To Point: With a cross section wafer map selected with CrossSection—Point to Point active, this specifies the vertical coordinate ofthe ending point for a Cross Section—Point to Point slice. A user wouldclick inside the selection box and type the desired value, inmillimeters from the wafer center.

Cross Section Autoscale: When the selected Wafer—Background Data is setto Cross Section and Cross Section Autoscale is set active, the fouraxis range parameters below Chart Autoscale allow a user to set custom Xand Y axis minimum and maximum values in the displayed wafer map. A userwould click the displayed current setting inside the selection box totoggle it to the opposite setting.

X Min, X Max: A user would click inside the selection boxes and type thedesired X axis minimum and maximum values.

Y Min. Y Max: A user would click inside the selection boxes and type thedesired Y axis minimum and maximum values.

Threshold Autoscale: When the selected Wafer—Background Data is set toSQM Height and Threshold Autoscale is set active, the four axis rangeparameters below Chart Autoscale allow a user to set custom X and Y axisminimum and maximum values in the displayed wafer map. A user wouldclick the displayed current setting inside the selection box to toggleit to the opposite setting.

3D Z-Scale: Intended for 3D contour maps only, this parameter applies ascale factor to the surface point values to exaggerate the modeledsurface as needed for improved readability. A user would click insidethe selection box and type a value greater than 0 and less than or equalto 1. Higher values increase the exaggeration of the Z axis data. FIG.29 shows a 3D Z-Scale set to 0.200, while FIG. 30 shows a 3D Z-Scale setto 1.000.

Defect Dot Size: This parameter controls the size of the displayeddefects when Wafer—Defects Particles is set active. A user woulddouble-click inside the selection box and select the desired sizebetween 1 (Tiny) to 6 (Very Large).

Draw Defects To Size: This parameter controls whether the displayeddefects are drawn relative to their actual size (Yes) or all drawn thesame size (No). A user would click the displayed current setting insidethe selection box to toggle it to the opposite setting.

Filter Defect Bins: This parameter allows the user to control theinitial display of Defect Bins on the WaferMap. Any bin listed here willbe filtered from the display, i.e. it will not be displayed. This isequivalent to unchecking the box next to the bin in the Legend Filter.

Filter Defect Bins (True Size): This parameter allows the user tocontrol the initial display of Defect Bins (True Size) on the WaferMap.Any bin listed here will be filtered from the display, i.e. it will notbe displayed. This is equivalent to unchecking the box next to the bin(true size) in the Legend Filter.

LCA—X Tolerance, LCA—Y Tolerance: These parameters are used for LostCommon Adder maps and counts, to determine how close a defect on thefirst wafer must be to a defect on the second wafer to be considered thesame defect.

Defect Particle Limit: This parameter specifies the maximum particlecount to use for composite defect wafer maps. Processing will stop ifthe total number of defects exceeds this value, avoiding lengthy delaysand unnecessary resource consumption. Processing will stop if the waferScan Limit is reached first.

Scan Limit for Composites: This parameter specifies the maximum numberof scans to use for composite wafer maps. Processing will stop if thetotal number of scans exceeds this value, avoiding lengthy delays andunnecessary resource consumption. For Defects, Processing will stop ifthe Defect Particle Limit is reached first.

Server System

Server system 04, which may comprise one or more servers, provides datastorage and retrieval infrastructure (database and files), generic datastorage code, data-type- and tool-specific data processing (convertingthe tools' data from the tools' formats to the format used by analysissystem 06), data management (storage, purge, backup, restore), taskexecution (including scheduling and triggering), server executables, andserver Configuration.

In the embodiments shown, server system 04 has a relational databasemanagement to facilitate the combination of metrology and inspectiontools and the Configuration Application software, which operates as aunified interface to a set of largely independent server applications.In one embodiment, the server is a computer running Microsoft SQLServer, providing and maintaining a relational database using the SQLlanguage, and the Configuration Application is a set of snap-ins to theMicrosoft Management Console (MMC).

Server Executables

The two primary server executables are EventApp and TaskApp. Theseshould be running at all times on an active server.

EventApp: The EventApp software implements the front-end of the server'sdata processing chain. As such, it runs the Tool Connects (whichidentifies incoming data and generates, but does not execute, tasks toprocess it), checks trigger conditions, and runs the Server's Scheduler.EventApp defers most of the processor-intensive work to the Server'sTask Queue.

TaskApp: The TaskApp software implements that back-end of the server'sdata processing chain, executing tasks from the Task Queue. Eachinstance of TaskApp can run 0 or more managed threads and 0 or moreunmanaged threads. Managed threads run only managed tasks, which aretasks that are expected to run within a “reasonable” time. If a managedtask takes too long, the system will notify any configuredadministrators via email. Unmanaged threads run only unmanaged tasks,which can take as long as they want to execute. Typically, only unusualactivities will run unmanaged.

The most basic configuration is to run one instance of TaskApp runningone managed and one unmanaged thread. This can run on the databaseserver machine, or any other machine. Adding threads and instances ofTaskApp (on additional machines) may increase system throughput,depending on the server machine(s) configuration(s).

Server Configuration

The Server Configuration is defined by the Server configurationApplication software. Installing the Configuration Application is asfollows: A Configuration Icon appears on the desktop screen of thedisplay of the server system 04. This icon is a shortcut to theConfig.msc file (ClientConfig.msc for client only install) located inthe server system 04 file directory. The .msc file contains the snap-insfor the MMC. A user can double-click on the icon to start up theConfiguration Application. If a client install is selected, the file mayneed to be associated with the application mmc.exe.

If the icon does not appear, a user should check the file directory tosee if the file exists. If it is not found, the user will need to set-upthe Configuration. To do this, the user brings up an MMC console bygoing to the Start menu, choosing Run, and running mmc.exe. In the MMCwindow, the user should go to the “Console” menu and choose “Add/RemoveSnap-in . . . This will pop up a dialog box. Choosing “Add . . . ” willpop up another dialog box. On the new dialog, the user should selectServerConfig from the list of available snap-ins, click the “Add” buttonand then the “Close” button, and then click “OK” in the “Add/RemoveSnap-in” dialog.

With reference now to FIG. 31, at this point, the tree-view pane 110 ofthe MMC window (the left window pane), should show a node called “SystemServers” below the node “Console Root”. The user should right-click onthe “System Servers” folder and choose the “Add Server . . . ” option,and then enter the name of the desired server, along with a login andpassword. If MMC is being run on the server to be configured, a usershould enter its name as “(local)”).

To be sure that the configuration modules have all been installedproperly, the user should expand the “System Servers” node, which shouldreveal a node for the server that was just added. Expanding the servernode shows a node called “System Databases”. If any databases have beencreated on the chosen server, expanding this node should list them byname. Expanding a database should show the following list of nodes:Directory Setup, Log Viewer, Configure Fab Key Names, Purge Data, ReportMaintenance, Tool Configuration, Users, Task Queue, Backup, ErrorHandling, Dimensional Recipes. In addition, users of the Defect and/orSQM features will see nodes for Defect Recipes and/or SQM Recipes.

Once the server console has been set up, the configuration may be savedby the following procedure:

-   Maximize the console root window by clicking on the box in the upper    right hand corner of the window.-   Go to Console menu and select options.-   Under console mode, select User mode-full access.-   Check the box that says “Do not save changes to this console.” Click    “ok.”-   Go to the Console menu again and select “Save as . . . ” Save the    file in the directory called \System, with the name Config.msc.-   Create a shortcut to this file on the desktop for quick access.

The process detailed above creates a configuration application thatpermanently stores the login information entered during the “Add Server. . . ” step. Thus, the user will not need to reenter login informationeach time the application is run. If this raises security concerns atthe facility where the configuration application is installed, a usermay skip the step adding the server before saving the application. Doingso will require that the user perform the add server step each timehe/she runs the application.

If an installation has multiple servers, they can all be supported byone configuration application. Users should simply perform the stepslisted above for adding a server for each server. Users can also changethe login used to access each server-right click on the name of theserver in the tree view and choose “Properties . . . ”, which will bringup a dialog asking for the login and password to use when accessing thatserver.

Configuration Application Features

The Configuration Application is a unified interface to a set of largelyindependent applications. The user navigates in the tree control of theMMC console to the desired server and database, and then chooses thedesired task. This brings up a GUI in the right MMC panel that can beused to perform that task. The following sections describe how toperform each task using the associated GUI.

Directory Setup—As Shown in FIG. 32

The Directory Setup screen of FIG. 32 allows a user to configure thevalues of the following directories:

-   Help Directory 112 (“Help Files”): The directory containing help    files.-   Server Binaries Directory 114 (“Server Binaries”): The directory in    which the server binaries are installed.-   Activities Directory 116 (“Activities”): The directory used for    storing activities created by Activity Manager.-   Server Output Directory 118 (“Server Output ”): The directory in    which the server will store generated files that must be retained    over a period of time. For example, reports generated by activities    run on the server are retained for a configurable period of time in    this directory. (To configure the lifetime of these files, “Purge    Data” screen, described later in this document, is used).

Hitting the “Commit” 120 button seen in FIG. 32 will save changes, whilehitting the “Reset” 122 button will discard them and reset theparameters to their previous setting.

Tool Configuration

The Tool Configuration feature of the Configuration Application allows auser to edit, create, delete and setup Tool Connects, which define howdata files are ingested into the Server system 04. The main ToolConfiguration GUI, shown in FIG. 33, shows information about thecurrently selected tool, which be changed by choosing a different toolin the “Tool” 130 combo box at the top. Below this box is a set of editboxes for Tool Directories and Files. In “Tool Output Directory” 132 boxa user can select the directory in which data files is or will bewritten from the tool. The path to the directory may be local or remote.

In the Data Storage Directory box displays the directory into which datafor this scan will be stored. The path for the Data Storage Directorywill be stored in the database. It should be a UNC path so that users onclient PCs can access the data on the server.

The lower two boxes indicate the “File Type” and “File Extension” of thedata generated by the tool. These are set by default. Still in FIG. 33,to the right of the Tool Directories and Files are six buttons used formanaging and setting up tools: “Configure New Tool” 134, “Delete Tool”136, “Copy Current Tool” 138, “Configure Thumbnails” 140, “Edit Keys . .. ” 142, and “Type-Specific Setup” 144. Each brings up a new dialog box.They will be discussed in turn below.

The two remaining buttons are “Save Changes” 146 and “Cancel Changes”148. Note that any changes made in the Tool Configuration dialog, or anydialog within, will not be saved until “Save Changes” 146 is hit.Changes may be discarded by hitting the “Cancel Changes” 148 button. Inthe present embodiment, changes to a Tool Connect's configuration willnot affect the server's data collection process until the EventAppapplication, described above, has been shutdown and restarted.

The following file types are supported:

-   Dimensional “THK/MEA/BW”, which is for tools that generate .thk,    .bw, mea, and text files, and “SDF”, which is for tools that    generate .sdf files.-   Defect: CR8X tools (.SAI) and AWIS (.csv)-   Nanatopography: AWIS (.SQM), CR8X (.PRN and HFP) and Nanomapper    (.MAP).

Configure New Tool: Still in FIG. 33, to add a new tool connect, choose“Configure New Tool” 134 from the main GUI screen. This will bring up awizard dialog for setting up a new tool connect. It will request thetool directory and file type information normally displayed on the mainGUI, as well as key configuration information for each key, thumbnailconfiguration and the type-specific setup. All of the data entered withthe Tool Configuration wizard can be modified after the Tool Connect hasbeen created, with the exception of the Tool name and file type. Whenfinished, a user would hit “Finish” and the new tool configuration willbe saved or “Cancel” to cancel the wizard.

Deleting Tool: Still in FIG. 33, to delete a tool connect, simply selectthe tool to be deleted on the main GUI, and hit the “Delete Tool” 136button. Once a tool has been deleted, it cannot be undeleted (except byre-entering all of its information from scratch).

Copy Current Tool: To make a new tool that has only minor differencesfrom an existing tool, use the “Copy Current Tool” 138 option. A dialogbox will appear showing the name of the tool to be copied (Source Tool)and asking for a new tool name and a new tool output directory. Enterthese values and click ok to save the new tool. This new tool willretain the configurations of the source tool until it is chosen in themain GUI and edited. This option is useful for setting up multiple toolsof the same type.

Configure Thumbnails: A set of thumbnails can be generated for eachwafer scan. These thumbnails can be selected with the “ConfigureThumbnails . . . ” 140 button. Click on the button and a dialog box asshown in FIGS. 34 and 35 will appear with the available options for thegiven tool type. A user would check the box next to the thumbnails to begenerated, or uncheck the box for those that are not required. Once adata file is ingested the chosen thumbnails will be generated. Eachthumbnail is about 4-5 Kb in size so it is prudent to choose only thethumbnails that are required. However, note that if additionalthumbnails are needed at a later time, the file must be re-ingested.

In the embodiments shown there are six dimensional and two sitethumbnails available for Dimensional Files, three thumbnails areavailable for SQM files and four thumbnails are available for CR8Xdefect data. Other combinations can be created without deviating fromthe spirit of the present invention.

Editing Keys, as Shown in FIG. 36.

To edit the key configurations for the current tool, a user may hit the“Edit Keys” button, which will bring up another dialog. The keyconfigurations are a way of specifying how certain information (“keys”)about each scan that is loaded should be determined. This information(the wafer id, lot id, tool id, operator name, etc.) tends to be storedin a different place at every customer facility, so how to extract eachkey from the data files produced by each tool may be custom-configured.

The options on the edit keys dialog of FIG. 36 are dependent on the typeof files generated by the tool. Regardless of the file types, there isalways a combo box near the top for selecting which key 150 toconfigure, and an entry field to specify a default value 152 for thatkey for the specified tool. The default value is required, and will beused as the value for the current key on the current tool whenever abetter value cannot be found. For the THK/BW/MEA, the SDF, .CSV (AWIS)and the SAI file type, a user may specify how to extract the key fromthe scan file and/or parse from the file name of the .thk, .sdf or .saifile as it comes off the tool. For the AWIS (.SQM) and Nanomapper filetypes, the key values can be parsed from the files, but the option toextract a key value from the scan file is not available for these filetypes.

Edit Keys for Dimensional Tools

To specify how to extract the key from the scan file, check the “Try toextract from scan file” box, and fill in the “Tag” field. Fordimensional data files, the tag is the value of the tag in the text filethat precedes the value to be extracted. For example, specifying a texttag of “Plant Order” indicates that the value of the current key shouldbe determined by finding the tag “Plant Order” in the text file, andextracting the value stored there: if the line in the .text file thatstarts with “Plant Order” looks like “Plant Order foo”, then the keyvalue will be set to “foo”. Key values for the .SAI and .CSV file typemust be entered by hand; there is no pull-down menu. In this case it isa keyword (not a tag) that is found in the comment fields of the file.The keyword can be anything; It is setup on the tool. The value for eachkeyword, with the exception of date/time in SAI files, is entered by thetool operator on a lot-by-lot basis. Date/time is always one of the SAIkeywords and its value is entered automatically.

Still in FIG. 36, as mentioned above, a user may also specify that akey's value may be extracted from the name of the file generated by thetool. A user does so by checking “Try to parse key from data file names”154 and filling in the “Beginning Delimiter”, “Ending Delimiter”, andtheir associated instance numbers, and selecting any of the three checkbox options (Parse filename from right to left, Delimiters arecase-insensitive, and Skip root filename when parsing) that arerequired.

The beginning delimiter specifies a string that immediately precedes thekey in the file name, and the beginning delimiter instance numberspecifies which instance of the beginning delimiter indicates thebeginning of the key.

When the “Parse filename from right to left” option is not selected,delimiter instances are counted from the left, meaning that theinstance'th instance of the delimiter, counting from the left, indicatesthe beginning of the key value. For example, if the beginning delimiteris “_” and the instance number is 2, then the key value startsimmediately after the second “__” in the file name.

Similarly, the ending delimiter specifies the string that occursimmediately after the key in the file name. When parsing from left toright, the ending delimiter instance number specifies which instance ofthe ending delimiter, counting from the beginning of the key, not thefile name, indicates the end of the key. Both the beginning delimiterand the ending delimiter may be empty strings (“ ”). An empty beginningdelimiter indicates that the key starts at the beginning of the filename. An empty ending delimiter indicates that the key ends at the endof the file name.

The three check box options are used to modify the basic behavior of theparser. If the “Parse filename from right to left” option is selected,then parsing proceeds right to left rather than left to right. Thebeginning delimiter still indicates the delimiter to the left of thekey, and the ending delimiter the delimiter to the right of the key.However, the key is discovered as follows: parsing starts at the rightof the filename, moving left until hitting the end delimiter instance'thinstance of the end delimiter. This indicates where the key ends.Parsing then proceeds to the left until reaching the begin delimiterinstance'th instance of the begin delimiter, which indicates thebeginning of the key. (Analogous to forward parsing, the begin delimiterinstance number counts from the end of key in this case, not from theend of the file name).

By default, delimiter names are case sensitive. Thus, a delimiterspecified as “p” will not match the character “P” in the actualfilename. To change this behavior, simply select the “Delimiters arecase-insensitive” check box.

Finally, for left-to-right parsing only, a user may select the “Skiproot filename when parsing” option. In this case, the initial part ofthe file name equal to root file name for the current batch of.thk/.mea/.bw files (as indicated in the text file) is ignored, and thenthe file name is parsed as it normally would, using <delim> as thebeginning delimiter. Consider the file name TEST18_(—)002_(—)00003.thk,where the root file name, as given in TEST18.text, is Beginning InstanceEnding Instance Parse Right Case Skip root Delimiter # Delimiter # ToLeft Insensitive file name Key Value — 1 — 1 False False False 002 — 1 .1 False False False 002_00003 — 2 . 1 False False False 00003 — 1 — 1False False True 002 (blank) 1 — 1 False false False TEST18 — 1 . 1 TrueFalse False 00003 — 2 . 1 True False False 002_00003 (blank) 1 — 2 TrueFalse False TEST18

Now consider the file name MyLotWithwsAndpsAndPsW5p2.sdf. The followingtable lists possible configurations and resulting key values: BeginningInstance Ending Instance Parse Right Case Skip root Delimiter #Delimiter # To Left Insensitive file name Key Value W 1 P 1 False FalseFalse ithwsAndpsAnd W 1 P 1 False True False ithwsAnd w 1 p 1 FalseFalse False sAnd W 2 P 2 False True False sAndpsAnd w 1 p 1 True TrueFalse 5 W 2 P 1 True True False sAndpsAndPsW5 P 1 . 1 True True False 2(blank) 1 W 2 True False False MyLot

As one final example, consider the file name823L1_EP6B_(—)003_(—)00004.thk, with a root file name of 823L1_EP6B. Ifthe beginning delimiter is “_”, the beginning delimiter instance #1, theending delimiter “_”, the ending delimiter instance #1, and “Skip rootfilename when parsing” is true, then the key is “003”.

Note that any changes made in the “Edit Keys” dialog will not be saveduntil “Save Changes” is hit on the main dialog. Hitting “Cancel Changes”on the main dialog discards changes.

Type-Specific Setup

Different tools require unique parameter settings. These are containedin the Type-Specific Setup. For dimensional tools using eitherTHK/BW/MEA or SDF files, click on this button to choose recipe(s). ForAWIS and Nanomapper tools, use the Type-Specific Setup to set theparameters for SQM. For CR8X tools, the Type-Specific Setup is used toset the parameters for both SQM and Defect file processing.

Dimensional Type-Specific Setup: Choose a dimensional tool from the toolpulldown menu and click on Type-Specific Setup. A dialog box, such asthe one shown in FIG. 37, will appear with a list of available RecipeNames 160. Click on Add 162 to choose a new recipe. To add recipes tothe list of available Recipe Names, go to the Dimensional Recipes node.To remove a recipe from the main list, select it by highlighting thename and clicking on the “Remove” 164 button. The number of recipesadded is user-specified, but each recipe is like performing anadditional scan of the wafer, i.e. summary data and thumbnails will begenerated for each recipe, and each requires additional processing timeand disk space. A special case is when Default is chosen as a recipe;the recipe that the tool was scanned with is used, but, in order to knowwhere the recipe is the path must be specified in the “Default RecipePath” field.

NanoMapper Type-Specific Setup.: Choose a NanoMapper tool from the toolpull-down menu and click on Type-Specific Setup to set thenanotopography parameters for the tool. A dialog box will appear forsetting the following: Staging Directory, Archive Directory (if theArchive Incoming Raw Data Files box is checked) and the wafer diameter.Finally, there is a selection box for the recipe. A list of recipes thatare currently selected will appear and can be added by clicking on the“Add . . . ” button. A box will appear with available recipes. Use thepull-down menu to select a recipe and click ok to add it to the list.(To add new recipes to the pull-down menu of available recipes, use thenanotopography Recipes node which is described below). To remove arecipe from the list, select it by highlighting the name and clicking onthe “Remove” button.

CR8X Type-Specific Setup: As shown in FIG. 38, a user would choose aCR8X tool from the tool pull-down menu and click on Type-Specific Setupto set the nanotopography and Defect parameters for the tool. A dialogbox such as that shown in FIG. 38 will appear for setting the following:Staging Directory 170, Recipe Directory 172 and Archive Directory 173(if the Archive Incoming Raw Data Files box is checked). Below thisthere are two check boxes, one to select Defect file 176 processing, theother to select SQM file processing 178. Turn either of these on or offfor the current tool. Select a recipe for each box that is checked andturned on. Click on the “Add . . . ” 180 button and select a recipe fromthe pull-down menu. Click “Ok” 184 and the recipe will be added to thelist.

To add new recipes to the pull-down menu of available recipes, a userwould use the Defect Recipes node and/or the nanotopography Recipesnode, both of which are described in below. To remove a recipe from thelist, select it by highlighting the name and clicking on the “Remove”182 button. The recipe directory indicates the location of the recipefile that comes from the tool. To process files using this recipe,choose default under Defect and/or nanotopography recipes. Finally,select either “Process all scans” 190 or “Process only from slots:” 192.If “Process only from slots:” 192 is chosen, the slot numbers of thefiles to be processed must be entered. The format is a list of slotnumbers separated by spaces. The value for the slot number comes fromthe edit key value for “sender slot”.

AWIS Defect CSV Type-Specific Setup: The AWIS system is available fromADE Corporation of Westwood, Mass. A user would choose an AWISDefect—CSV tool from the tool pull-down menu and click on Type-SpecificSetup to set the Defect parameters for the tool. The dialog box of FIG.39 will appear for setting the following: Staging Directory 200, andArchive Directory 202 (if the Archive Incoming Raw Data Files box ischecked). Below this there are two check boxes, one to discard eventswith −1 bin code 204, the other to run the True Size Algorithm 206 (forThin Films Tools). Click on the “Add . . . ” 208 button and select arecipe from the pull-down menu. Click “Ok” 210 and the recipe will beadded to the list. (To add new recipes to the pull-down menu ofavailable recipes, use the Defect Recipes node, described below). Toremove a recipe from the list, select it by highlighting the name andclicking on the “Remove” 212 button. Choosing the True Size Algorithm206 may require setting up a True Size Bin Set in the Defect Recipesnode.

Defect Recipes

Recipes for processing Defect data files are created and edited usingthe Defect node of the server system 04 GUI. The node is divided intotwo sections:.General and Configuration Sets. Changes to the recipe aresaved by clicking on the “Commit” button. A user would use the “Reset”button to discard any changes made since the last time “Commit” was hit.

General

Defect recipes are stored in the database of server system 04. Recipesare created and edited in draft mode as shown in FIG. 40. They can beleft in draft mode, where they are available for use in analysis system06 during recalculation. However, recipes in draft mode are notavailable for tool connects, i.e. for the ingest of data. Recipes needto be taken out of draft mode (by un-checking the draft box) for use iningesting. Here, they are effectively “read only”. Non-draft recipes areavailable for use in both the client and the tool connects.

Still in FIG. 40, to create a new recipe, either click on “New” 220 orchoose a recipe from the pull-down menu and select “Copy . . . ” . Inboth cases a dialog box will appear asking the user to input the name ofthe new recipe.

New or copied recipes are automatically placed into draft mode so theycan be edited. Once a recipe is taken out of draft mode and the “Commit”button has been hit, it cannot be placed back into draft mode.

The name of a recipe is changed by hitting the “Name . . . ” 222 button.Enter a new name in the dialog box and hit “Ok. The name of ANY recipecan be changed, even one that has been taken out of draft mode. Enter adescription for each new recipe in the “Description” 226 box. Note, inthe embodiments shown, the server system 04 will not check for duplicaterecipes or sets in this node of the MMC. Before creating a new recipe,check the properties of the existing recipes.

Still in FIG. 40, recipes can be deleted by using the “Delete” 228button. Note: Recipes that are currently being used in a toolconfiguration cannot be deleted. Recipes that are referenced by any scancurrently stored in the database also cannot be deleted.

Recipes labeled “Empty” and “Default” are available in the“Type-specific setup” for tool configurations and in the client via therecipes menu. These recipes are not true recipes since they cannot beedited in the Defect Recipes node. Rather, these recipes indicatewhether certain processing algorithms should be executed. The “Empty”setting indicates that no recipe algorithms should be processed. The“Default” setting indicates that recipe with which the wafer was scannedon the tool should be used. That tool recipe should be located in therecipes directory at the time the files are ingested into the database.The tool recipe is read and a recipe, renamed with a database recipename, is stored in the database to save the configuration information.When files are ingested using the “Default” recipe, server system 04checks to see if a copy of the tool recipe has already been saved in thedatabase and lists the database recipe name as the Defect Recipe forthis scan.

Configurations Sets

Still in FIG. 40, the “Configuration Sets” 230 section of the GUI isused to set up the recipe parameters. The “Bin Set” 232 and “Bin StatusSet” 234 are typically set to default. These two sets can then becreated from the bin set definition in the recipe and raw data files atingest. The Bin 232 and Bin Status 234 Sets can be predefined by theuser and selected in the recipe from the pulldown menus next to each setlisting. Each Bin Status 234 set must be associated with a Bin Set. Usermay also choose the “none” option for both the Bin 232 and Bin Status234 sets and the files will be ingested without any binning. Theremaining sets, Color 236, Combination 238, Region 240, Ring 242 andSector 244 can be set to none or default (currently these functionidentically) or they may be pre-defined by the user. To create new setsor view existing sets, use the “Edit Sets” button. Note: If apre-defined Region 240, Ring 242 or Sector 244 set for a given recipe ischosen, a Color 236 Set for that recipe should also be defined andselected so that the defect density can be properly displayed on thewafer map.

Click on the “Edit Sets” 246 button and a dialog box will appear. Selectthe type of set the user wishes to edit from the pull-down menu adjacentto “Set:”, i.e. Bin Set 232, Ring 242 Set, etc. For each set type, alist of available sets and a description of each set will be shown inthe box below. Bin 232, Bin Status, 234 Color 236, Combination 238,Region 240, Ring 242 and Sector 244 Sets can be created, edited and/orviewed by selecting from pull-down menu in the Configuration Sets dialogbox of FIG. 40. Selecting new or edit will bring up the edit dialog boxfor that set. See below for details on creating and editing these sets.Each set should be edited in draft mode and taken out of draft mode onceall changes have been made. As with the recipe itself, once the set istaken out of draft mode, the set becomes read-only and no furtherchanges can be made.

Once the general and configuration sets have been configured, click on“Commit” 248 to save the recipe.

Nanotopography Recipes

Recipes for processing and reprocessing of nanotopography data files arecreated and edited using the Nanotopography Recipes node of the serversystem 04 GUI. The node is divided into two sections: General andConfiguration Sets. To save changes to a recipe, click on the “Commit”button. Use the “Reset” button to discard any changes e made since thelast time “Commit” was hit.

General

Nanotopography recipes are stored in the main database 08 of the Serversystem 04. Recipes are created and edited in draft mode. They can beleft in draft mode, where they are available for use in the clientduring recalculation. However, recipes in draft mode are not availablefor tool connects, i.e. for ingesting data. Recipes need to be taken outof draft mode (by un-checking the draft box) for use in ingesting. Herethey are effectively “read only”. Non-draft recipes are available foruse in both the client and the tool connects.

Nanotopography Recipes are illustrated in FIG. 41. To create a newrecipe, a user would either click on “New” 250 or choose a recipe fromthe pull-down menu and select “Copy . . . ” 252. In both cases a dialogbox will appear asking for inputting of the name of the new recipe. Newor copied recipes are automatically placed into draft mode so they canbe edited. Once a recipe is taken out of draft mode and the “Commit”button has been hit, it cannot be placed back into draft mode. The nameof a recipe may be changed by hitting the “Name . . . ” 254 button. Auser would enter a new name in the dialog box and hit “Ok”. The name ofANY recipe can be changed, even one that has been taken out of draftmode. A user would enter a description for each new recipe in the“Description” 256 box.

Recipes can be deleted by using the “Delete” 258 button. Recipes thatare currently being used in a tool configuration cannot be deleted.Recipes that are referenced by any scan currently stored in the databasealso cannot be deleted.

For Nanotopography Recipes there are two parameters that must be set fordata processing. Click on the “Parameters . . . ” 260 button and adialog box will appear. Currently, there are two parameters that can beset here: CR8X emulation and Laser Mark Exclusion. Check the Yes/No boxto set these two parameters: “Should CR8X emulation mode be used whenprocessing scan data?” “Should laser mark exclusion be used whenprocessing scan data?”

Configuration Sets

The “Configuration Sets” 260 section of the GUI is used to set up therecipe parameters. The “Bin Set” 262, “Bin Status Set”, 264 “CalibrationSet” 268 and “Exclusion Zone Set” 270 can be selected from the adjacentpull-down menus that contain all the sets currently available. To editexisting sets or create new sets, use the “Edit Sets” 272 button.

Still in FIG. 41, lick on the “Edit Sets” 272 button and a dialog boxwill appear. Select the type of set to edit from the pull-down menuadjacent to “Set:”, i.e. Bin Set, Bin Status Set, Calibration Set orExclusion Zone Set. For each set type, a list of available sets and adescription of each set will be shown in the box below. A user caneither create a new set, or select a current set and edit, delete orcopy it. Selecting new or edit will bring up the edit dialog box forthat set. See below for details on creating and editing these sets. Eachset should be edited in draft mode and taken out of draft mode once allchanges have been made. As with the recipe itself, once the set is takenout of draft mode, the set becomes read-only and no further changes canbe made.

Once the general and configuration sets have been configured, click on“Commit” 274 to save the recipe.

Dimensional Recipes are shown in FIG. 42. Recipes for processingDimensional recipes are created and edited using the Dimensional node ofthe Server system 04 GUI This node consists of a main dialog box listingthe recipe name and the path to the recipe, as seen in FIG. 42.

In FIG. 42, click on New 280 to specify a new recipe name and path, orselect a recipe and chose Edit 282 to modify the recipe name and/orpath. The dialog shown in FIG. 43 will appear.

Enter the recipe name 272 and the path 276 for a recipe the user wishesto create and/or modify. Note: the recipe name must be included in thepath. To Delete a recipe, highlight the recipe and chose “Delete”. Arecipe cannot be deleted if it is referenced by an existing scan in thedatabase or if it is specified in the type-specific setup of a toolconnect.

Purge Data

The Purge Data GUI shown in FIG. 44 allows the user to control theautomatic, selective removal (“purging”) of old data from the datastore. The strategy may be input manually at any time or it may occurautomatically at selected intervals of times, using a purge mask and anautomated scheduling system. By defining one or more “purge masks”, auser can specify what types of files are purged at what age. A user canspecify how long to keep selected type of data for a selected tool byCustomer, Product, Process, Lot, Wafer, and User Scan. Users may specifykeeping certain data in a record or associated with it, and purgingother data, such as temporary files. As an example, certain data in arecord could be kept for 30 days, while associated thumbnails and scanfiles could be deleted after 10 days.

The main purge screen of FIG. 44 will display all active masks. Byselecting the “New Mask” 280 or “Edit Mask” 282 buttons, the Edit/NewPurge Mask screen shown in FIG. 45 will be displayed. Here a user candefine what values for the keys (lot, process, etc) are to used for thismask, and a purge age for the different types of data (database, scandata, thumbnails). After a mask is defined, any scan data that matchesthe key definitions will be purged based on the age definitions of thedifferent data types.

The data types of “Temp Data” and “Archived Data” are special cases.These do NOT use the key fields in the mask definition, only the fileage parameter. The unused fields are grayed out whenever a Temp orArchived file age is defined. Each time purge is run (either by usingthe “Purge Now“284 button shown in FIG. 44 or through the scheduleroption), each purge mask in the list is evaluated and the appropriatefiles and records are deleted.

Purge also provides the option of monitoring disks to insure that theydo not get too full. A user may select the drive letter to be monitored,in the “Max % Threshold” enter the maximum percentage of that drive thatcan be full before there is a problem, and optionally enter an emailaddress to be sent a notification when a drive has exceeded its allowedthreshold.

Still in FIG. 44, if a user wishes to have the system automaticallypurge all data meeting specified criteria, selecting the “Automaticallyperform purge” 288 check box and entering how often the user wishes thisto occur (in days) and the desired time of day for the purge (ideally,the time of day should be when other system activities, both server andclient, are at a minimum) provides an automatic purge.

Preferably, setting up automatic purge operations should be done on theserver. Remotely setting up automatic purge operations is notrecommended. Further, automatic purging cannot be configured remotelyunless a periodic purge task has already been set up in the Windows NTscheduler.

In addition, manually executed purge operations may be performed byhitting the “Purge Now” 286 button. However, purge operations can bevery time consuming (up to several hours when purging large amounts ofdata), and the configuration application will be unusable throughout theduration of a manually executed purge. Once a purge has begun, purgeoperations may be cancelled by “killing” the configuration applicationin the Windows NT Task Manager, which is not recommended.

The Purge Main GUI is shown in FIG. 47. The Purge Mask Definition GUI isillustrated in FIG. 45.

Archive/Restore

Turning now to FIG. 46, with Local Archive, a user may archive selectedtype of data for a selected tool by Customer, Product, Process, Lot,Wafer, and User Scan, using a fixed date range or a relative date range,as shown in FIG. 46. Data so selected (Scan Files, dimensional or defectdata, database records) may be backed up to DVD at any Data AnalysisSystem by use of a DataTool Connect operating as an input to a DVD, orit may be transmitted to another integrated management system foradditional review.

The following description of the archiving procedure will focus onarchiving scan data, but it can equally apply to setup data, toolconfigurations, and layout definitions. Two categories of archiving areprovided. The first is a manual archive where the user selects items inthe gallery and is given the choice of an archive database name and pathlocation. The second category is an automatic archive that will be anextension of the purge utility. Both of them archive the selected datato a zip file.

Manual Archiving

A dataset is loaded and displayed in the gallery using a query asdescribed above. Selecting one or a group of items in the gallery, theuser right clicks and chooses the “Archive” function.

Automatic Archiving

Automatic archiving is defined with an archive mask, such as the onedepicted in FIG. 48. A user opens the mask through the Purge/Archivescreen of the Configuration application (shown in FIG. 47 as the NewArchive Mask 302 button). A new archive mask, shown in FIG. 48, iscreated to capture all scans for the process desired.

The archive mask will be processed along with purge masks duringscheduled automatic purge/archive activities. The next scheduledauto-purge/archive will process this new archive mask resulting incopying database information of the desired scans to an archivedatabase.

Restoration of Archived Data

A tool configuration is used to restore archive files into a database.Configuration of this tool consists of designating a tool outputdirectory that an event application monitors for archived zip files. TheConfiguration Application has two software applications, EventApp andTaskApp, described below, that may be used to incorporate the archivedata into the main database 08.

Archive/Restore Architecture

Archiving Data

The architecture for archiving is based on archiving scan data from theSQL server main database 08 to a Microsoft Access database. As notedabove, archiving will be initiated either manually from the client bythe user selecting items in the gallery or automatically by setting uparchive masks.

If the archive is initiated manually from the client, the user suppliesthe name and path of the archive database. If initiated from the serverusing a mask, the name will be automatically generated from the maskkeys while the path is part of the mask setup.

However initiated, the archive database is put into a temp directoryalong with associated scan files and thumbnail files and a copy of thedimensional recipes, if any. The entire contents of this temp directoryare then zipped into one file; a filename is generated from the name ofthe archive database and placed in the path designated for the archive.The temp directory is then deleted.

The major components of archiving are: 1) creating a database using theMicrosoft Access database system, 2) creating tables in the newdatabase, and 3) copying all data associated with the scan, includingassociated scan and thumbnail files, into an archive.

Create the Database

Creation of the database will use a “Catalog” object that contains a“Create” method. A CreateArchiveDatabase method requires a database nameand directory as inputs, defined by the user when archiving is performedmanually or defined by the Server system 04 when archiving is performedautomatically. A CreateArchiveDatabase is found in the IDBUtilinterface. With manual archive, a dialog box opens, and the user entersan archive database name and path. When the user clicks “OK”, an archivedatabase is created of the database records associated with the selectedscan. With automatic archive, the Server system 04 defines a databasename and archive directory.

Create the Tables

All scan data archive databases will contain the same tables (seebelow). These tables will be created by a generic routine that, whenprovided with the SQL Server table name as an input, will generate acorresponding table in the database.

A SQL Server stored procedure “sp_columns” returns the column headings,column datatypes, and column data length. This information is used togenerate the corresponding database tables. This approach will removethe requirement of keeping the table creation software in sync withversion updates that might alter table definition.

It will be noted that tables are created in the archive database thatmirror the corresponding tables in the main database 08. The tableproperties of column heading, datatype and data length are obtainedusing a SQL Server stored procedure “sp_help”.

The archiving of Defect, Dimensional, and nanotopography scans requirethe creation and archiving of disparate table types. Creation of thearchive database will add these three lists together and generate allthe tables even though many will not be populated.

The following tables are required to archive Defect, Dimensional, andnanotopography scans:

-   Defect Scans: ProcessScan, DefectData, WaferClassification,    WaferClassificationNames, ConsolidatedSummaries, DefectCodeSummary,    DefectRecipes, BinSets, Bins, BinStatusSets, BinStatuses, TSBinSets,    TSBins, RingSets, Rings, SectorSets, Sectors, UserDefRegionSets.    UserDefinedRegions ClassificationCodeSets, ClassificationCodes,    ClusterSets, Clusters, ColorSets, Colors, CombinationSets,    Combinations, COPParams, and DefectRecipeProperties.-   Dimensional Scans: ProcessScan, IMPData, Recipes, SiteMapParams-   SQM Scans: ProcessScan, SQMData, SQMCodeSummary, SQM BinSets, SQM    Bins, SQM StatusSets, SQM Statuses, SQMCalibrationSets,    SQMCalibrations, ExclusionZoneSets, ExclusionZones, SQM    RecipeProperties.    Copying the Data

Scan records to be archived all have a unique ‘id’: DefectDataID fordefect scans, SQMDataID for nanotopography scans, and the combination ofProcessScanID and RecipeID for dimensional scans. IDBUtil has aprocedure for accepting the unique ID's as defined by scan type, andthen copying all associated data to the archived database. Associatedscan files and thumbnail files are copied to an archive file directoryin a temporary work area, using the same sub-directory structure andfile names that the task manager created when the scan was ingested.

In the case of dimensional scans, each of which has a recipe associatedtherewith, the database record, as created above, or the recipe table,as created above, contains the path to the recipe being used. This pathmay be local or somewhere on the network. A copy of the recipe is copiedinto the temporary work area, and the path is updated to point to thelocation of the copied recipe.

Once the data is archived into the new database and associated filestructure, it may be placed into a zip file. If the archiving isperformed manually, a pop-up screen will be displayed requesting alocation for storing the archive .zip file, which may be local orsomewhere on the network. If the archiving is performed automatically,the location of the archive zip file will be pre-defined, again local orsomewhere on the network.

Restoration Of Archived Data

Restoration of archived data involves treating the archived scans asthough they are scans from another tool in the analysis system 06. The“tool” in this case is an “Archive/Restore” tool having its own toolconfiguration, described in more detail below. The archived database(.zip) to be restored will be copied to the tool output directory to beprocessed by the EventApp software, which accesses the database in thetool output directory, and the TaskApp software, which works with thecopy in the staging directory.

Instead of merely copying archive records back to corresponding tablesin the main database 08, the Archive Restoration procedure actuallypulls information from the archived database just as it does from othertool output files. Archived data is then added to the database as a newscan. Thus, the restoration is independent of the database version.Alternatively, instead of having to parse through an input file for thekey values, EventApp obtains the values directly from ProcessScan table.

EventApp processes Defect and SQM Recipes by loading the requiredvariables from the archive database and through existing software, anddetermining if the recipe already exists or a new one needs to becreated. Dimensional recipes are restored from the archived copy; andthe path to the recipe altered in the database.

For every archived scan, EventApp adds a task to the Task Queue of theServer system 04 and places a copy of the archive database in thestaging directory.

The DoTask handler in the Task Queue activates TaskApp processing. TheDoTask handler task processes data contained in the archive database inthe same manner as it processes data in any input file, runningalgorithms on the acquired data, loading algorithm results into thevarious tables, and creating XML and thumbnail files.

A new field “RestoredDateTime” is added to the IMPData, DefectData, andSQMData tables. This field serves two purposes, 1) If the field is ‘notNULL’, then it will be known that the associated scan is a restoredscan. 2) Purge masks can use this field to determine whether or not topurge the scan (n days after restored date).

Archive/Restore User Interface

There are two main components of the Archive/Restore user interface. Thefirst component is setting up an archive mask while the second isconfiguring an archive/restore tool for restoring archived information.

Archive Mask

The purge mask utility of the Configuration application includes bothpurge masks and archive masks as shown in FIG. 47. In FIG. 47, the masktype 304 indicates either “Archive” or “Purge”. The last column 306indicates where the archive file will be stored. A new control,“Restored Records Age” 308 allows the user to control how long restoredfiles are kept. Clicking on the “New Archive Mask” 300 button creates anew archive mask. The dialog box shown in FIG. 48 is displayed. Clickingon “Save” will add the specified mask to the database, close the dialogbox, and display the new mask in the “Purge/Archive Data” screen of FIG.47.

Archive/Restore Tool Config

The restore operation is designed to treat the archive data as a specialtool. Instead of just moving records to the main database 08, thearchive database is queried for ingest data similar to parsing a tool'soutput file. As shown in FIG. 49, setting up a tool Config for archivedata restoration is done via the tool Config screen of the ConfigurationApplication. Clicking on “Configure New Tool” 320 activates the toolConfig wizard 322. The “File Type” 324 list control includes an“Archive_Restore” selection. Selecting this type will set the extensionto “zip” as shown in FIG. 50. Now in FIG. 50, clicking on “Next” 332displays the dialog box to configure tool specific parameters. The onlyparameter that needs setting in the “Configure Archive/RestoreParameters” dialog box, which is displayed in FIG. 51, is the stagingdirectory. Clicking on “Next” 332 of FIG. 51 displays the last dialogbox of the wizard, shown in FIG. 52. Clicking “Finish” 334 in FIG. 52configures the new “Archive/Restore” tool.

Multi-Plant Data Management

The Data Management system of the present invention provides acapability to transfer data to another selected Integrated DataManagement system, whether local or remote, in order that data frommultiple sites can be compared and overall process optimized.Transmitted data may be reviewed off-line either individually or withdata from other systems in order to make comparisons of productionsystems.

The Archive/Restore functionality described above may be used to makesystem data available to other sites, such as a central site. Asdescribed above, users may specify, manually or automatically a locationin which to store the archived data; the location may be local orremote. Using the Archive Restoration procedure described above, thesystem that archived the data (or any other system having access to thelocation where the data are stored) may retrieve the data for additionalanalysis. Data for multiple production lots, multiple processes, ormultiple sites may thus be combined.

Providing transfer of selected data, especially in connection withproviding automatic transmission of such data, to other systems allowsusers easy access to data for corporate-wide quality control of multiplefabrication facilities and for efficient transfer of selectedinformation to customers.

-   Log-in: A user would log in to the integrated system in the same way    as described above and shown in FIG. 53.-   Review data: Data would be reviewed either individually, such as the    wafer map gallery shown in FIG. 54.    Alternatively, data could be compared across fabrication sites, as    shown in FIG. 55.    Autonomous Updating

The Autonomous Updating feature allows users to configure their clientstation to automatically refresh at selected intervals the gallery usingthe last query issued. The results from the query will be displayed inthe gallery (in either list or thumbnail view), sorted by date with themost recent scan at the top. The purpose of this feature is to providethe user with an automated way of seeing new scans as they come into thesystem. The procedure for Autonomous Updating follows:

-   User issues query manually and populates the gallery as shown in    FIG. 57.-   User Selects Autonomous Update 340 from the menu in FIG. 57.-   The user enables the option, as shown in FIG. 58, by checking on the    box 342 and entering how many seconds 344 between updates (such as N    seconds) are desired, and clicking on “OK” 346.-   After OK is clicked the last query will be reissued every N seconds,    allowing the user to see a constantly updating gallery.    Multiple Wafer Default Map Layout

The differences between defect and dimensional data require viewing bydifferent layouts. Commingling defect and dimensional data in the samewafer gallery, as is done in the present invention, requires switchingbetween the layouts. Manually selecting a layout to use each time that auser switches between defect and dimensional data can be burdensome.

The system of the present invention provides a multiple default wafermap layout feature, in which multiple wafer map layouts (at least adefault dimensional and a default defect layout) may be saved asdefaults so that maps of different data types may be displayed. Usersmay simply double click on a map in the gallery to display analternative layout. The system keeps track of which layouts (defect ordimensional) are designated as defaults. When a user double clicks on amap in the gallery, the system determines its map type (for example,whether it is a defect or dimensional map) and assigns the appropriatelayout for the map given its type. The system GUI supports multipledefault wafer map functionality using the following features:

Creating a Wafer Map Layout

The wafer map layout creation screen shown in FIG. 59, has a field 350to indicate the type of data for which the layout is intended. In theembodiment shown, the types are defect or dimensional data. When theuser chooses the data type, thus defining the layout type, the layoutparameters that apply to the selected data type are displayed in thelayout definition screen.

Default Wafermap Icon

Referring now to FIG. 4, when the user hovers over the “defaultwafermap” icon on the dataset display screen, multiple layout names aredisplayed in the tooltip. As shown in FIG. 60, two types are displayed,one for defect and one for dimensional.

Specifying the Default Wafer Map Layout

A default wafer map layout is specified using the following process:

-   1. In the Utility Window 20 of FIG. 4, click the Wafers 26 tab.-   2. Right-click and select Wafer Map >Set Default Layout.-   3. Select one of the available wafer map layouts and click OK. An    Options button is provided to allow a user to toggle the list of    layouts to include only the layouts that a specific user has created    or layouts created by all users.

The current default wafer map layout may be determined at any time bylocating the Wafer, Map icon in the Utility Window 20's Wafers 26 taband placing the cursor over it. A ToolTip display will report thecurrent default wafer map layout name in parentheses.

Viewing Wafer Maps

Wafer maps may be viewed using the existing layout, or using a defaultlayout.

Displaying a Wafer Map from the Wafers Tab Using a Selected Layout

This method selects an existing wafer map layout, then creates a wafermap using the currently selected wafers in the currently selecteddataset.

-   1. Create a new dataset or load an existing dataset.-   2. In the Utility Window 20 of FIG. 4, click the Wafers 26 tab to    display the dataset.-   3. Highlight the wafers of interest by clicking on individual    records in an extended data wafer list or by clicking on individual    thumbnails in the gallery. Use the <Shift> and <Ctrl> keys to select    multiple wafers. To include all of the wafers in the dataset,    right-click and select Select All.-   4. Make sure the cursor is on one of the selected wafers, then    right-click and select Wafer Map.-   5. If multiple wafers are selected, the Composite Selected Wafers    item, which may be set using a checkmark, may be set to “checked” if    all of the wafers are to be combined into a single wafer map. The    item may be set to “unchecked” if a separate wafer map for each    wafer selected is preferred.-   6. Make sure the cursor is on one of the selected wafer or wafers,    then right-click and select Wafer Map>Run With Selected Layout.-   7. From the list of wafer map layouts, click the desired layout and    click OK. The wafer map is displayed using the selected wafer    records and wafer map layout settings.    Displaying a Wafer Map from the Wafers Tab Using the Default Layout

A frequently used wafer map layout, specified as default wafer maplayout as described above, may be selected for a currently selected setof wafers in the currently selected dataset, using the followingprocedure (which requires fewer keystrokes than the previous method andavoids having to search all of the available layouts):

-   1. Create a new dataset or load an existing dataset.-   2. In the Utility Window 20 of FIG. 4, click the Wafers 26 tab to    display the dataset.-   3. Highlight the wafers of interest by clicking on individual    records in the extended data wafer list or by clicking on individual    thumbnails in the gallery. Use the <Shift> and <Ctrl> keys to select    multiple wafers. To include all of the wafers in the dataset,    right-click and select Select All.-   4. Make sure the cursor is on one of the selected wafers, then    right-click and select Wafer Map.-   5. If multiple wafers are selected, the Composite Selected Wafers    item may be set to “checked” if all of the wafers are to be combined    into a single wafer map. The item may be set to “unchecked” if a    separate wafer map for each wafer selected is preferred.-   6. Click the Wafer Map icon above the wafer gallery or list, or make    sure the cursor is on one of the selected wafers, then right-click    and select Wafer Map>Run With Default Layout. The wafer map is    displayed using the selected wafer records and wafer map layout    settings.

It is important to note that, while the present invention has beendescribed in the context of a fully functioning data processing system,those of ordinary skill in the art will appreciate that the processes ofthe present invention are capable of being distributed in the form of acomputer readable medium of instructions and a variety of forms, andthat the present invention applies equally regardless of the particulartype of signal bearing media actually used to carry out thedistribution. Examples of computer readable media includerecordable-type media such as floppy discs, hard disk drives, RAM,CD-ROMs, and transmission-type media, such as digital and analogcommunications links.

Additionally, while the present invention has been implemented using theWindows NT™ operating system from Microsoft Corporation, and Microsoft'sSQL and AccessT™ databases, those skilled in the art will appreciatethat other operating systems and database management programs could beused without deviating from the spirit of the present invention.

The description of the present invention has been presented for purposesof illustration and description but is not intended to be exhaustive orlimited to the invention in the form disclosed. Many modifications andvariations will be apparent to those of ordinary skill in the art. Thisembodiment was chosen and described in order to best explain theprinciples of the invention, the practical application, and to enableothers of ordinary skill in the art to understand the invention forvarious embodiments with various modifications as are suited to theparticular use contemplated. Modifications of the presently disclosedinvention are possible without departing from the scope of the appendedclaims.

1. A system for the integrated archiving, restoring, purging, importingand exporting of semiconductor wafer data for use in siliconmanufacturing and device fabrication processes, comprising: a network; adata acquisition system capable of acquiring scan data from differingtypes of semiconductor wafer scanning tools such as wafer dimensionaltools, wafer inspection tools, and wafer nanotopography tools, the dataacquisition system being capable of communicating over the network; abuffer system for providing temporary storage for scan data transmittedover the network from the data acquisition system and for providingfault tolerance; a server system for providing storage for the scan datatransmitted from the buffer system over the network, the server systemconverting the scan data into a format used by and stored in a databasemanagement system; an analysis system client station including a displayand communicating with the server system over the network, the analysissystem and the server system being capable of operating as a transfermanager for purging, archiving, restoring, importing and exporting scandata.
 2. The system of claim 1, wherein the transfer manager furthercomprises a manual purging operation enabling a user to manually purgeold scan data from the database.
 3. The system of claim 1, wherein thetransfer manager further comprises an automated purging operation forenabling a user to define a purge mask to determine which scan data willbe purged from the database and upon what schedule.
 4. The system ofclaim 1, wherein the transfer manager further comprises a manualarchiving operating for enabling a user to manually select scan data tobe archived and to designate a database and location in which it is tobe stored.
 5. The system of claim 1, wherein the transfer managerfurther comprises a manual restore operation for enabling a user tomanually select archived scan data from a database to be restored to adesignated database in a designated location.
 6. The system of claim 1,wherein the transfer manager further comprises an archive and restoretool for ingesting archived scan data from a designated database andrestoring it to a designated database in designated location.
 7. Thesystem of claim 6, wherein the archive and restore tool furthercomprises a version independent restore operation for ingesting archivedscan data from a designated database as though it had been newlyacquired from the data acquisition subsystem, making the restoreoperation independent of database version changes.
 8. The system ofclaim 6, wherein the archive and restore tool further comprises anautomated archiving operation for enabling a user to define an archivemask for the archive and restore tool, the mask specifying which scandata will be archived, upon what schedule, from which database, and towhich database and location.
 9. The system of claim 6, wherein thearchive and restore tool further comprises an automated restoringoperation for enabling a user to define an archive mask for the archiveand restore tool, the mask specifying which scan data will be restored,upon what schedule, from which database and to which database andlocation.
 10. The system of claim 7, wherein the archive and restoretool further comprises a version independent automated restoringoperation for enabling a user to define an archive mask for the archiveand restore tool, the mask specifying which scan data will be restored,upon what schedule, from which database and to which database andlocation.
 11. The system of claim 6, wherein the transfer managerfurther comprises a multi-plant data management system having thecapability to transfer and share scan data between different physicalsites.
 12. The system of claim 11, wherein the multi-plant datamanagement system further comprises a user specified procedure fordirecting the archive and restore tool to export scan data to at leastone other site so that scan data from at least two sites can be reviewedfor process optimization.
 13. The system of claim 11, wherein themulti-plant data management system further comprises a user specifiedprocedure for directing the archive and restore tool to import andrestore scan data from at least one other site to a central location foranalysis and review, thereby enabling the central location to reviewscan data from a plurality of production lots, processes, and sites. 14.The system of claim 12, wherein the user specified procedure fordirecting the archive and restore tool to export scan data furthercomprises parameters that can be specified for automating the exportingof scan data.
 15. The system of claim 13, wherein the user specifiedprocedure for directing the archive and restore tool to import andrestore scan data further comprises parameters that can be specified forautomating the importing and restoring of scan data.
 16. A method forthe integrated archiving, restoring, purging, importing and exporting ofsemiconductor wafer data for use in silicon manufacturing and devicefabrication processes, comprising the steps of: communicating over anetwork; acquiring scan data from differing types of semiconductor waferscanning tools such as wafer dimensional tools, wafer inspection tools,and wafer nanotopography tools using a data acquisition system, the dataacquisition system being capable of communicating over the network;providing temporary storage and fault tolerance for scan datatransmitted over the network from the data acquisition system by using abuffer system; providing storage for the scan data transmitted from thebuffer system over the network using a server system, the server systemconverting the scan data into a format used by and stored in a databasemanagement system; analyzing scan data using an analysis system clientstation including a display and communicating with the server systemover the network, the analysis system and the server system beingcapable of managing the purging, archiving, restoring, importing andexporting of scan data.
 17. The method of claim 16, wherein the step ofmanaging further comprises the step of enabling a user to manually purgeold scan data from the database.
 18. The method of claim 16, wherein thestep of managing further comprises the step of automatically purgingscan data by enabling a user to define a purge mask to determine whichscan data will be purged automatically from the database and upon whatschedule.
 19. The method of claim 16, wherein the step of managingfurther comprises the step of enabling a user to manually select scandata to be archived and to designate a database and location in which itis to be stored.
 20. The method of claim 16, wherein the step ofmanaging further comprises the step of enabling a user to manuallyselect archived scan data from a database to be restored to a designateddatabase in a designated location.
 21. The method of claim 16, whereinthe step of managing further comprises the step of using an archive andrestore tool for ingesting archived scan data from a designated databaseand restoring it to a designated database in a designated location. 22.The method of claim 21, wherein the step of using an archive and restoretool further comprises the step of using a version independent restoreoperation for ingesting archived scan data from a designated database asthough it had been newly acquired from the data acquisition subsystem,making the restore operation independent of database version changes.23. The method of claim 21, wherein the step of using an archive andrestore tool further comprises the step of automating an archivingoperation by enabling a user to define an archive mask for the archiveand restore tool, the mask specifying which scan data will be archived,upon what schedule, from which database, and to which database andlocation.
 24. The method of claim 21, wherein the step of using anarchive and restore tool further comprises the step of automating arestore operation by enabling a user to define an archive mask for thearchive and restore tool, the mask specifying which scan data will berestored, upon what schedule, from which database and to which databaseand location.
 25. The system of claim 22, wherein the step of using anarchive and restore tool further comprises the step of using a versionindependent automated restore operation by enabling a user to define anarchive mask for the archive and restore tool, the mask specifying whichscan data will be restored, upon what schedule, from which database andto which database and location.
 26. The method of claim 21, wherein thestep of managing further comprises the step of managing scan databetween at least two plants using a multi-plant data management systemcapable of transferring and sharing scan data between different physicalsites.
 27. The method of claim 26, wherein the step of using amulti-plant data management system further comprises the step of a userdirecting the archive and restore tool to export scan data to at leastone other site so that scan data from at least two sites can be reviewedfor process optimization.
 28. The method of claim 27, wherein the stepof using a multi-plant data management system further comprises the stepof a user directing the archive and restore tool to import and restorescan data from at least one other site to a central location foranalysis and review, thereby enabling the central location to reviewscan data from a plurality of production lots, processes, and sites. 29.The method of claim 27, wherein the step of directing the archive andrestore tool to export scan data further comprises the step ofspecifying parameters for automating the exporting of scan data.
 30. Themethod of claim 28, wherein the step of directing the archive andrestore tool to import and restore scan data further comprises the stepof specifying parameters for automating the importing and restoring ofscan data.
 31. A software program product implemented on a processorreadable medium including instructions performed on a data processor forthe integrated archiving, restoring, purging, importing and exporting ofsemiconductor wafer data for use in silicon manufacturing and devicefabrication processes, the instructions comprising: instructions forcommunicating over a network; instructions for acquiring scan data fromdiffering types of semiconductor wafer scanning tools such as waferdimensional tools, wafer inspection tools, and wafer nanotopographytools using a data acquisition system, the data acquisition system beingcapable of communicating over the network; instructions for providingtemporary storage and fault tolerance for scan data transmitted over thenetwork from the data acquisition system by using a buffer system;instructions for providing storage for the scan data transmitted fromthe buffer system over the network using a server system, the serversystem converting the scan data into a format used by and stored in adatabase management system; instructions for analyzing scan data usingan analysis system client station including a display and communicatingwith the server system over the network, the analysis system and theserver system being capable of managing the purging, archiving,restoring, importing and exporting of scan data.